FI-S8P-HFE JAE Electronics
| Anzahl | Privatkunde |
|---|---|
| 1+ | 4.38 EUR |
| 10+ | 3.72 EUR |
| 100+ | 3.31 EUR |
| 500+ | 2.87 EUR |
| 1000+ | 2.76 EUR |
| 5000+ | 2.75 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
Produktrezensionen
Produktbewertung abgeben
Technische Details FI-S8P-HFE JAE Electronics
Description: CONN HEADER SMD R/A 8POS 1.25MM, Features: Solder Retention, Packaging: Strip, Connector Type: Receptacle, Voltage Rating: 200V, Current Rating (Amps): 1A per Contact, Mounting Type: Surface Mount, Right Angle, Number of Positions: 8, Number of Rows: 1, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 80°C, Contact Type: Male Pin, Fastening Type: Friction Lock, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Copper Alloy, Insulation Color: Beige, Pitch - Mating: 0.049" (1.25mm), Contact Finish - Mating: Gold, Contact Finish - Post: Tin or Tin-Alloy, Part Status: Active, Contact Shape: Square, Insulation Height: 0.071" (1.80mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled.
Weitere Produktangebote FI-S8P-HFE nach Preis ab 2.82 EUR bis 5.19 EUR
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FI-S8P-HFE | JAE Electronics |
Description: CONN HEADER SMD R/A 8POS 1.25MMFeatures: Solder Retention Packaging: Strip Connector Type: Receptacle Voltage Rating: 200V Current Rating (Amps): 1A per Contact Mounting Type: Surface Mount, Right Angle Number of Positions: 8 Number of Rows: 1 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 80°C Contact Type: Male Pin Fastening Type: Friction Lock Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Copper Alloy Insulation Color: Beige Pitch - Mating: 0.049" (1.25mm) Contact Finish - Mating: Gold Contact Finish - Post: Tin or Tin-Alloy Part Status: Active Contact Shape: Square Insulation Height: 0.071" (1.80mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled |
auf Bestellung 4596 Stücke: Lieferzeit 10-14 Tag (e) |
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| FI-S8P-HFE |
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Hersteller: JAE Electronics
Description: CONN HEADER SMD R/A 8POS 1.25MM
Features: Solder Retention
Packaging: Strip
Connector Type: Receptacle
Voltage Rating: 200V
Current Rating (Amps): 1A per Contact
Mounting Type: Surface Mount, Right Angle
Number of Positions: 8
Number of Rows: 1
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 80°C
Contact Type: Male Pin
Fastening Type: Friction Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Beige
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Tin or Tin-Alloy
Part Status: Active
Contact Shape: Square
Insulation Height: 0.071" (1.80mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Description: CONN HEADER SMD R/A 8POS 1.25MM
Features: Solder Retention
Packaging: Strip
Connector Type: Receptacle
Voltage Rating: 200V
Current Rating (Amps): 1A per Contact
Mounting Type: Surface Mount, Right Angle
Number of Positions: 8
Number of Rows: 1
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 80°C
Contact Type: Male Pin
Fastening Type: Friction Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Beige
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Tin or Tin-Alloy
Part Status: Active
Contact Shape: Square
Insulation Height: 0.071" (1.80mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
auf Bestellung 4596 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 5.19 EUR |
| 10+ | 4.24 EUR |
| 100+ | 3.46 EUR |
| 500+ | 3 EUR |
| 1000+ | 2.82 EUR |


