
FI-TD44SB-E-R750 JAE Electronics
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Technische Details FI-TD44SB-E-R750 JAE Electronics
Description: CONN RCPT 44POS 0.05 GOLD SMD, Features: Board Guide, Pick and Place, Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Current Rating (Amps): 0.5A per Contact, Mounting Type: Surface Mount, Number of Positions: 44, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 85°C, Contact Type: Center Strip Contact, Fastening Type: Latch Holder, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Mated Stacking Heights: 7.35mm, Insulation Color: Black, Pitch - Mating: 0.020" (0.50mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Insulation Height: 0.222" (5.65mm), Number of Rows: 1.
Weitere Produktangebote FI-TD44SB-E-R750
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FI-TD44SB-E-R750 | Hersteller : JAE Electronics |
![]() Features: Board Guide, Pick and Place, Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 0.5A per Contact Mounting Type: Surface Mount Number of Positions: 44 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 85°C Contact Type: Center Strip Contact Fastening Type: Latch Holder Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Mated Stacking Heights: 7.35mm Insulation Color: Black Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Insulation Height: 0.222" (5.65mm) Number of Rows: 1 |
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