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FI-W21P-HFE-E1500

FI-W21P-HFE-E1500 JAE Electronics


Board-to-CableConn_PG_V2.2.pdf Hersteller: JAE Electronics
Description: CONN HEADER SMD R/A 21POS 1.25MM
Packaging: Tape & Reel (TR)
Features: Solder Retention
Connector Type: Receptacle
Voltage Rating: 200V
Current Rating (Amps): 1A per Contact
Mounting Type: Surface Mount, Right Angle
Number of Positions: 21
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 80°C
Contact Type: Male Pin
Fastening Type: Friction Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Tin or Tin-Alloy
Part Status: Active
Contact Shape: Square
Insulation Height: 0.146" (3.70mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polyphenylene Sulfide (PPS), Glass Filled
Row Spacing - Mating: 0.055" (1.40mm)
Contact Length - Mating: 0.094" (2.40mm)
auf Bestellung 1500 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1500+3.9 EUR
Mindestbestellmenge: 1500
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Technische Details FI-W21P-HFE-E1500 JAE Electronics

Description: CONN HEADER SMD R/A 21POS 1.25MM, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Receptacle, Voltage Rating: 200V, Current Rating (Amps): 1A per Contact, Mounting Type: Surface Mount, Right Angle, Number of Positions: 21, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 80°C, Contact Type: Male Pin, Fastening Type: Friction Lock, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Copper Alloy, Insulation Color: Black, Pitch - Mating: 0.049" (1.25mm), Contact Finish - Mating: Gold, Contact Finish - Post: Tin or Tin-Alloy, Part Status: Active, Contact Shape: Square, Insulation Height: 0.146" (3.70mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Polyphenylene Sulfide (PPS), Glass Filled, Row Spacing - Mating: 0.055" (1.40mm), Contact Length - Mating: 0.094" (2.40mm).

Weitere Produktangebote FI-W21P-HFE-E1500 nach Preis ab 4.73 EUR bis 6.95 EUR

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
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FI-W21P-HFE-E1500 FI-W21P-HFE-E1500 Hersteller : JAE Electronics Board-to-CableConn_PG_V2.2.pdf Description: CONN HEADER SMD R/A 21POS 1.25MM
Packaging: Cut Tape (CT)
Features: Solder Retention
Connector Type: Receptacle
Voltage Rating: 200V
Current Rating (Amps): 1A per Contact
Mounting Type: Surface Mount, Right Angle
Number of Positions: 21
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 80°C
Contact Type: Male Pin
Fastening Type: Friction Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Tin or Tin-Alloy
Part Status: Active
Contact Shape: Square
Insulation Height: 0.146" (3.70mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polyphenylene Sulfide (PPS), Glass Filled
Row Spacing - Mating: 0.055" (1.40mm)
Contact Length - Mating: 0.094" (2.40mm)
auf Bestellung 2917 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+6.95 EUR
10+ 6.32 EUR
100+ 5.56 EUR
500+ 4.73 EUR
Mindestbestellmenge: 3
FI-W21P-HFE-E1500 FI-W21P-HFE-E1500 Hersteller : JAE Electronics Board-to-CableConn_PG_V2.2.pdf Headers & Wire Housings 21p Recep RA SMT LCD Compatible
auf Bestellung 1056 Stücke:
Lieferzeit 14-28 Tag (e)