FLE-115-01-G-DV-P Samtec
Hersteller: SamtecBoard to Board & Mezzanine Connectors Cost Effective Surface Mount Socket, 0.050" Pitch
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 6.74 EUR |
| 30+ | 6.16 EUR |
| 60+ | 5.58 EUR |
| 120+ | 5.14 EUR |
| 510+ | 4.73 EUR |
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Technische Details FLE-115-01-G-DV-P Samtec
Description: CONN RCPT 30POS 0.05 GOLD SMD, Packaging: Tube, Features: Pick and Place, Connector Type: Receptacle, Current Rating (Amps): 2A per Contact, Mounting Type: Surface Mount, Number of Positions: 30, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Gold, Insulation Height: 0.172" (4.37mm), Row Spacing - Mating: 0.050" (1.27mm), Number of Rows: 2.
Weitere Produktangebote FLE-115-01-G-DV-P
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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FLE-115-01-G-DV-P | Hersteller : Samtec Inc. |
Description: CONN RCPT 30POS 0.05 GOLD SMD Packaging: Tube Features: Pick and Place Connector Type: Receptacle Current Rating (Amps): 2A per Contact Mounting Type: Surface Mount Number of Positions: 30 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Insulation Height: 0.172" (4.37mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 2 |
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