FS01MR08A8MA2CHPSA1 Infineon Technologies
Hersteller: Infineon Technologies
Description: FS01MR08A8MA2CHPSA1
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 6 N-Channel (Phase Leg)
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Drain to Source Voltage (Vdss): 750V
Current - Continuous Drain (Id) @ 25°C: 620A (Tj)
Input Capacitance (Ciss) (Max) @ Vds: 43000pF @ 470V
Rds On (Max) @ Id, Vgs: 1.69mOhm @ 620A, 18V
Gate Charge (Qg) (Max) @ Vgs: 1500nC @ 18V
Vgs(th) (Max) @ Id: 4.55V @ 200mA
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Technische Details FS01MR08A8MA2CHPSA1 Infineon Technologies
Description: FS01MR08A8MA2CHPSA1, Packaging: Tray, Package / Case: Module, Mounting Type: Chassis Mount, Configuration: 6 N-Channel (Phase Leg), Operating Temperature: -40°C ~ 175°C (TJ), Technology: Silicon Carbide (SiC), Drain to Source Voltage (Vdss): 750V, Current - Continuous Drain (Id) @ 25°C: 620A (Tj), Input Capacitance (Ciss) (Max) @ Vds: 43000pF @ 470V, Rds On (Max) @ Id, Vgs: 1.69mOhm @ 620A, 18V, Gate Charge (Qg) (Max) @ Vgs: 1500nC @ 18V, Vgs(th) (Max) @ Id: 4.55V @ 200mA.
Weitere Produktangebote FS01MR08A8MA2CHPSA1 nach Preis ab 1835.64 EUR bis 1835.64 EUR
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FS01MR08A8MA2CHPSA1 | Hersteller : Infineon Technologies |
Discrete Semiconductor Modules HybridPACK Drive G2 module with SiC MOSFET |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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