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FS32R372SDK0MMM

FS32R372SDK0MMM NXP USA Inc.


S32R372DS.pdf Hersteller: NXP USA Inc.
Description: 1MB SRAM, 1.3MB FLASH, C
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Interface: CAN, I²C, LINFlexD, SPI
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.19V ~ 1.31V
Program Memory Type: FLASH (1.3MB)
Applications: Automotive & Industrial Radar
Core Processor: e200z7
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
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Technische Details FS32R372SDK0MMM NXP USA Inc.

Description: 1MB SRAM, 1.3MB FLASH, C, Packaging: Tray, Package / Case: 257-LFBGA, Mounting Type: Surface Mount, Interface: CAN, I²C, LINFlexD, SPI, RAM Size: 1M x 8, Operating Temperature: -40°C ~ 125°C (TA), Voltage - Supply: 1.19V ~ 1.31V, Program Memory Type: FLASH (1.3MB), Applications: Automotive & Industrial Radar, Core Processor: e200z7, Supplier Device Package: 257-LFBGA (14x14), Part Status: Active, DigiKey Programmable: Not Verified.