FW-08-02-G-D-468-075 Samtec Inc.
Hersteller: Samtec Inc.Description: FLEXIBLE MICRO BOARD STACKING HE
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.050" (1.27mm)
Row Spacing: 0.050" (1.27mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 16
Length - Overall Pin: 0.618" (15.697mm)
Length - Post (Mating): 0.075" (1.905mm)
Length - Stack Height: 0.468" (11.887mm)
Length - Tail: 0.075" (1.905mm)
auf Bestellung 107 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 7.46 EUR |
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Technische Details FW-08-02-G-D-468-075 Samtec Inc.
Description: FLEXIBLE MICRO BOARD STACKING HE, Packaging: Bulk, Color: Black, Mounting Type: Through Hole, Pitch: 0.050" (1.27mm), Row Spacing: 0.050" (1.27mm), Termination: Solder, Contact Finish - Post (Mating): Gold, Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm), Number of Rows: 2, Number of Positions: 16, Length - Overall Pin: 0.618" (15.697mm), Length - Post (Mating): 0.075" (1.905mm), Length - Stack Height: 0.468" (11.887mm), Length - Tail: 0.075" (1.905mm).
Weitere Produktangebote FW-08-02-G-D-468-075
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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FW-08-02-G-D-468-075 | Hersteller : Samtec |
Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050" Pitch |
Produkt ist nicht verfügbar |
