GL535/N ALUTRONIC
Hersteller: ALUTRONIC
Category: Heatsinks - equipment
Description: Heat transfer pad; mica; TO218,TOP3; Dim: 22x18mm; Thk: 0.05mm
Type of heatsink accessories: heat transfer pad
Application: TO218; TOP3
Dielectric strength: 2.5kV
Mounting: screw
Thickness: 50µm
Dimensions: 22x18mm
Thermal conductivity: 0.8W/mK
Kind of heat transfer pad: mica
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Technische Details GL535/N ALUTRONIC
Category: Heatsinks - equipment, Description: Heat transfer pad; mica; TO218,TOP3; Dim: 22x18mm; Thk: 0.05mm, Type of heatsink accessories: heat transfer pad, Application: TO218; TOP3, Dielectric strength: 2.5kV, Mounting: screw, Thickness: 50µm, Dimensions: 22x18mm, Thermal conductivity: 0.8W/mK, Kind of heat transfer pad: mica.

