GL535/N ALUTRONIC
Hersteller: ALUTRONIC
Category: Heatsinks - equipment
Description: Heat transfer pad: mica; TO218,TOP3; Thk: 0.05mm; 800mW/mK; 2.5kV
Type of heat transfer pad: mica
Application: TO218; TOP3
Thickness: 50µm
Thermal conductivity: 0.8W/mK
Dielectric strength: 2.5kV
Dimensions: 22x18mm
Mounting: screw
Category: Heatsinks - equipment
Description: Heat transfer pad: mica; TO218,TOP3; Thk: 0.05mm; 800mW/mK; 2.5kV
Type of heat transfer pad: mica
Application: TO218; TOP3
Thickness: 50µm
Thermal conductivity: 0.8W/mK
Dielectric strength: 2.5kV
Dimensions: 22x18mm
Mounting: screw
auf Bestellung 172 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 172+ | 0.41 EUR |
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Technische Details GL535/N ALUTRONIC
Category: Heatsinks - equipment, Description: Heat transfer pad: mica; TO218,TOP3; Thk: 0.05mm; 800mW/mK; 2.5kV, Type of heat transfer pad: mica, Application: TO218; TOP3, Thickness: 50µm, Thermal conductivity: 0.8W/mK, Dielectric strength: 2.5kV, Dimensions: 22x18mm, Mounting: screw.