GP1000SF-0.015-02-0816 Bergquist
Hersteller: BergquistDescription: GAP PAD THERM CON SI-FREE
Part Status: Active
Packaging: Bulk
Color: Green
Material: Non-Silicone
Shape: Rectangular
Thickness: 0.0150" (0.381mm)
Type: Gap Filler Pad, Sheet
Usage: Thermally Conductive
Outline: 406.40mm x 203.20mm
Thermal Conductivity: 0.9W/m-K
Adhesive: Tacky - Both Sides
Backing, Carrier: Fiberglass
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Technische Details GP1000SF-0.015-02-0816 Bergquist
Description: GAP PAD THERM CON SI-FREE, Part Status: Active, Packaging: Bulk, Color: Green, Material: Non-Silicone, Shape: Rectangular, Thickness: 0.0150" (0.381mm), Type: Gap Filler Pad, Sheet, Usage: Thermally Conductive, Outline: 406.40mm x 203.20mm, Thermal Conductivity: 0.9W/m-K, Adhesive: Tacky - Both Sides, Backing, Carrier: Fiberglass.
Weitere Produktangebote GP1000SF-0.015-02-0816
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GP1000SF-0.015-02-0816 | Hersteller : Bergquist Company |
Thermal Interface Products GAP PAD, Conductive, Sil-Free, 8"x16" Sheet, 0.015" Thickness, TGP1100SF/1000SF |
Produkt ist nicht verfügbar |