GP1000SF-0.015-02-0816 Bergquist Company
Hersteller: Bergquist CompanyThermal Interface Products GAP PAD, Conductive, Sil-Free, 8"x16" Sheet, 0.015" Thickness, TGP1100SF/1000SF
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 102.22 EUR |
| 10+ | 92.08 EUR |
| 25+ | 86.12 EUR |
| 50+ | 83 EUR |
| 100+ | 79.99 EUR |
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Technische Details GP1000SF-0.015-02-0816 Bergquist Company
Description: GAP PAD THERM CON SI-FREE, Packaging: Bulk, Color: Green, Material: Non-Silicone, Shape: Rectangular, Thickness: 0.0150" (0.381mm), Type: Gap Filler Pad, Sheet, Usage: Thermally Conductive, Outline: 406.40mm x 203.20mm, Thermal Conductivity: 0.9W/m-K, Adhesive: Tacky - Both Sides, Backing, Carrier: Fiberglass, Part Status: Active.
Weitere Produktangebote GP1000SF-0.015-02-0816
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| GP1000SF-0.015-02-0816 | Hersteller : Bergquist |
Description: GAP PAD THERM CON SI-FREE Packaging: Bulk Color: Green Material: Non-Silicone Shape: Rectangular Thickness: 0.0150" (0.381mm) Type: Gap Filler Pad, Sheet Usage: Thermally Conductive Outline: 406.40mm x 203.20mm Thermal Conductivity: 0.9W/m-K Adhesive: Tacky - Both Sides Backing, Carrier: Fiberglass Part Status: Active |
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