GTL16612DGG,118 NXP USA Inc.
Hersteller: NXP USA Inc.Description: IC TRANSLATOR BIDIR 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Supplier Device Package: 56-TSSOP
Channel Type: Bidirectional
Output Signal: LVTTL, TTL
Translator Type: Mixed Signal
Channels per Circuit: 18
Input Signal: GTL
Part Status: Obsolete
Number of Circuits: 1
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Technische Details GTL16612DGG,118 NXP USA Inc.
Description: IC TRANSLATOR BIDIR 56TSSOP, Packaging: Tape & Reel (TR), Package / Case: 56-TFSOP (0.240", 6.10mm Width), Output Type: Tri-State, Non-Inverted, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 85°C, Supplier Device Package: 56-TSSOP, Channel Type: Bidirectional, Output Signal: LVTTL, TTL, Translator Type: Mixed Signal, Channels per Circuit: 18, Input Signal: GTL, Part Status: Obsolete, Number of Circuits: 1.