H3175-01 HARWIN
Hersteller: HARWIN
Category: Other connectors
Description: Connector: socket; 2A; PIN: 1; vertical; gold-plated; brass; 1.42mm
Body material: brass
Contact plating: gold-plated
Type of connector: socket
Spatial orientation: vertical
Operating temperature: -55...125°C
Cable external diameter: 1.42mm
Enclosure material: brass
Number of pins: 1
Current rating: 2A
| Anzahl | Privatkunde |
|---|---|
| 84+ | 1.02 EUR |
| 105+ | 0.81 EUR |
| 111+ | 0.77 EUR |
| 115+ | 0.74 EUR |
| 120+ | 0.71 EUR |
| 250+ | 0.68 EUR |
| 500+ | 0.65 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details H3175-01 HARWIN
Description: CONN PIN RCPT .016-.021 PRESSFIT, Packaging: Bulk, Contact Finish: Gold, Flange Diameter: 0.019" (0.48mm), Length - Overall: 0.656" (16.66mm), Termination: Press-Fit, Mounting Hole Diameter: 0.039" ~ 0.043" (0.99mm ~ 1.09mm), Contact Finish Thickness: 3.94µin (0.10µm), Contact Material: Beryllium Copper, Tail Type: Wire Wrap, Accepts Pin Diameter: 0.016" ~ 0.021" (0.41mm ~ 0.53mm), Tail Diameter: 0.025" (0.64mm), Socket Depth: 0.128" (3.25mm), Part Status: Active.
Weitere Produktangebote H3175-01 nach Preis ab 0.87 EUR bis 1.87 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
H3175-01 | Harwin Inc. |
Description: CONN PIN RCPT .016-.021 PRESSFITPackaging: Bulk Contact Finish: Gold Flange Diameter: 0.019" (0.48mm) Length - Overall: 0.656" (16.66mm) Termination: Press-Fit Mounting Hole Diameter: 0.039" ~ 0.043" (0.99mm ~ 1.09mm) Contact Finish Thickness: 3.94µin (0.10µm) Contact Material: Beryllium Copper Tail Type: Wire Wrap Accepts Pin Diameter: 0.016" ~ 0.021" (0.41mm ~ 0.53mm) Tail Diameter: 0.025" (0.64mm) Socket Depth: 0.128" (3.25mm) Part Status: Active |
auf Bestellung 17013 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
H3175-01 | Harwin |
Circuit Board Hardware - PCB H31 Vertical SMT Contact Removable Jumper Ln |
auf Bestellung 70397 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||
|
H3175-01 | HARWIN |
Description: HARWIN - H3175-01 - IC- & Baustein-Sockel, 1 Kontakt(e), Subminiatur-Buchse, BerylliumkupfertariffCode: 85366990 productTraceability: No Kontaktüberzug: Vergoldete Kontakte Steckverbindertyp: Subminiatur-Buchse rohsCompliant: Y-EX Rastermaß: - Anzahl der Kontakte: 1Kontakt(e) euEccn: NLR Kontaktmaterial: Berylliumkupfer hazardous: false Reihenabstand: - rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: - SVHC: Lead (17-Jan-2023) |
auf Bestellung 1910 Stücke: Lieferzeit 14-21 Tag (e) |
|
| H3175-01 |
![]() |
Hersteller: Harwin Inc.
Description: CONN PIN RCPT .016-.021 PRESSFIT
Packaging: Bulk
Contact Finish: Gold
Flange Diameter: 0.019" (0.48mm)
Length - Overall: 0.656" (16.66mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.039" ~ 0.043" (0.99mm ~ 1.09mm)
Contact Finish Thickness: 3.94µin (0.10µm)
Contact Material: Beryllium Copper
Tail Type: Wire Wrap
Accepts Pin Diameter: 0.016" ~ 0.021" (0.41mm ~ 0.53mm)
Tail Diameter: 0.025" (0.64mm)
Socket Depth: 0.128" (3.25mm)
Part Status: Active
Description: CONN PIN RCPT .016-.021 PRESSFIT
Packaging: Bulk
Contact Finish: Gold
Flange Diameter: 0.019" (0.48mm)
Length - Overall: 0.656" (16.66mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.039" ~ 0.043" (0.99mm ~ 1.09mm)
Contact Finish Thickness: 3.94µin (0.10µm)
Contact Material: Beryllium Copper
Tail Type: Wire Wrap
Accepts Pin Diameter: 0.016" ~ 0.021" (0.41mm ~ 0.53mm)
Tail Diameter: 0.025" (0.64mm)
Socket Depth: 0.128" (3.25mm)
Part Status: Active
auf Bestellung 17013 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 13+ | 1.68 EUR |
| 15+ | 1.43 EUR |
| 25+ | 1.33 EUR |
| 50+ | 1.27 EUR |
| 100+ | 1.21 EUR |
| 250+ | 1.13 EUR |
| 500+ | 1.08 EUR |
| 1000+ | 1.04 EUR |
| 3000+ | 0.95 EUR |
| H3175-01 |
![]() |
Hersteller: Harwin
Circuit Board Hardware - PCB H31 Vertical SMT Contact Removable Jumper Ln
Circuit Board Hardware - PCB H31 Vertical SMT Contact Removable Jumper Ln
auf Bestellung 70397 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 1.69 EUR |
| 10+ | 1.25 EUR |
| 100+ | 1.02 EUR |
| 1000+ | 0.87 EUR |
| H3175-01 |
![]() |
Hersteller: HARWIN
Description: HARWIN - H3175-01 - IC- & Baustein-Sockel, 1 Kontakt(e), Subminiatur-Buchse, Berylliumkupfer
tariffCode: 85366990
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
Steckverbindertyp: Subminiatur-Buchse
rohsCompliant: Y-EX
Rastermaß: -
Anzahl der Kontakte: 1Kontakt(e)
euEccn: NLR
Kontaktmaterial: Berylliumkupfer
hazardous: false
Reihenabstand: -
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: -
SVHC: Lead (17-Jan-2023)
Description: HARWIN - H3175-01 - IC- & Baustein-Sockel, 1 Kontakt(e), Subminiatur-Buchse, Berylliumkupfer
tariffCode: 85366990
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
Steckverbindertyp: Subminiatur-Buchse
rohsCompliant: Y-EX
Rastermaß: -
Anzahl der Kontakte: 1Kontakt(e)
euEccn: NLR
Kontaktmaterial: Berylliumkupfer
hazardous: false
Reihenabstand: -
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: -
SVHC: Lead (17-Jan-2023)
auf Bestellung 1910 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 134+ | 1.87 EUR |
| 162+ | 1.44 EUR |
| 250+ | 1.2 EUR |
| 500+ | 1.08 EUR |
| 1000+ | 0.96 EUR |




