HDAM-23-12.0-S-13-2-P Samtec Inc.
Hersteller: Samtec Inc.
Description: 2.00 MM X 1.20 MM HD MEZZ RUGGED
Features: Board Guide, Pick and Place
Packaging: Tray
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 299
Pitch: 0.047" (1.20mm)
Height Above Board: 0.683" (17.35mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 20mm, 30mm
Number of Rows: 13
Description: 2.00 MM X 1.20 MM HD MEZZ RUGGED
Features: Board Guide, Pick and Place
Packaging: Tray
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 299
Pitch: 0.047" (1.20mm)
Height Above Board: 0.683" (17.35mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 20mm, 30mm
Number of Rows: 13
auf Bestellung 504 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 18+ | 101.2 EUR |
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Technische Details HDAM-23-12.0-S-13-2-P Samtec Inc.
Description: 2.00 MM X 1.20 MM HD MEZZ RUGGED, Features: Board Guide, Pick and Place, Packaging: Tray, Connector Type: High Density Array, Male, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 299, Pitch: 0.047" (1.20mm), Height Above Board: 0.683" (17.35mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 20mm, 30mm, Number of Rows: 13.
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