HDG200-DN-3 H&D Wireless AB
Hersteller: H&D Wireless ABDescription: IC RF TXRX+MCU WIFI 44TQFN
Packaging: Tray
Package / Case: 44-TQFN Exposed Pad Module
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 1kB EEPROM, 160kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.75V ~ 3.6V
Power - Output: 17dBm
Protocol: 802.11b/g/n
Current - Receiving: 49mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 197mA
Supplier Device Package: 44-QFN SIP (8x8)
RF Family/Standard: WiFi
Serial Interfaces: SDIO, SPI
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 80 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 62.18 EUR |
| 10+ | 57.4 EUR |
| 25+ | 52.62 EUR |
| 80+ | 48.63 EUR |
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Technische Details HDG200-DN-3 H&D Wireless AB
Description: IC RF TXRX+MCU WIFI 44TQFN, Packaging: Tray, Package / Case: 44-TQFN Exposed Pad Module, Mounting Type: Surface Mount, Frequency: 2.4GHz, Memory Size: 1kB EEPROM, 160kB SRAM, Type: TxRx + MCU, Operating Temperature: -40°C ~ 85°C, Voltage - Supply: 2.75V ~ 3.6V, Power - Output: 17dBm, Protocol: 802.11b/g/n, Current - Receiving: 49mA, Data Rate (Max): 72.2Mbps, Current - Transmitting: 197mA, Supplier Device Package: 44-QFN SIP (8x8), RF Family/Standard: WiFi, Serial Interfaces: SDIO, SPI, Part Status: Active, DigiKey Programmable: Not Verified.