HDR100IMP80M-G-V-SM Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: CONN HEADER SMD 80POS 2.54MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 80
Number of Rows: 2
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Contact Shape: Square
Insulation Height: 0.098" (2.50mm)
Shrouding: Unshrouded
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.236" (6.00mm)
Description: CONN HEADER SMD 80POS 2.54MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 80
Number of Rows: 2
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Contact Shape: Square
Insulation Height: 0.098" (2.50mm)
Shrouding: Unshrouded
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.236" (6.00mm)
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Technische Details HDR100IMP80M-G-V-SM Chip Quik Inc.
Description: CONN HEADER SMD 80POS 2.54MM, Packaging: Bulk, Connector Type: Header, Breakaway, Mounting Type: Surface Mount, Number of Positions: 80, Number of Rows: 2, Style: Board to Board, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish - Post: Gold, Contact Shape: Square, Insulation Height: 0.098" (2.50mm), Shrouding: Unshrouded, Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.236" (6.00mm).