Produkte > BERGQUIST > HF115AC-0.0055-AC-90

HF115AC-0.0055-AC-90 Bergquist


BERGQUIST-HI-FLOW-THF-800AC-en_GL.pdf
Hersteller: Bergquist
Description: THERM PAD 21.84MMX18.79MM W/ADH
Packaging: Bulk
Color: Gray
Material: Phase Change Compound
Shape: Rectangular
Thickness: 0.0055" (0.140mm)
Type: Pad, Sheet
Thermal Resistivity: 0.35°C/W
Usage: TO-218, TO-220, TO-247
Outline: 21.84mm x 18.79mm
Thermal Conductivity: 0.8W/m-K
Adhesive: Adhesive - One Side
Backing, Carrier: Fiberglass
Part Status: Active
auf Bestellung 6189 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
15+1.4 EUR
17+1.25 EUR
25+1.19 EUR
50+1.15 EUR
100+1.11 EUR
300+1.05 EUR
500+1.02 EUR
1000+0.99 EUR
5000+0.93 EUR
Mindestbestellmenge: 15 Stücke
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Technische Details HF115AC-0.0055-AC-90 Bergquist

Description: THERM PAD 21.84MMX18.79MM W/ADH, Packaging: Bulk, Color: Gray, Material: Phase Change Compound, Shape: Rectangular, Thickness: 0.0055" (0.140mm), Type: Pad, Sheet, Thermal Resistivity: 0.35°C/W, Usage: TO-218, TO-220, TO-247, Outline: 21.84mm x 18.79mm, Thermal Conductivity: 0.8W/m-K, Adhesive: Adhesive - One Side, Backing, Carrier: Fiberglass, Part Status: Active.