auf Bestellung 94 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 5.77 EUR |
| 111+ | 4.1 EUR |
| 518+ | 3.66 EUR |
| 1036+ | 3.5 EUR |
Produktrezensionen
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Technische Details HPF-03-02-T-S-LC-K Samtec
Description: .200 HI POWER SOCKET ASSEMBLY, Features: Board Lock, Pick and Place, Packaging: Tube, Connector Type: Receptacle, Mounting Type: Surface Mount, Number of Positions: 3, Style: Board to Board, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Insulation Color: Black, Pitch - Mating: 0.200" (5.08mm), Contact Finish - Mating: Tin, Contact Finish - Post: Tin, Insulation Height: 0.351" (8.92mm), Number of Rows: 1.
Weitere Produktangebote HPF-03-02-T-S-LC-K
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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HPF-03-02-T-S-LC-K | Hersteller : Samtec |
Conn Socket Strip SKT 3 POS 5.08mm Solder ST SMD Tube |
Produkt ist nicht verfügbar |
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HPF-03-02-T-S-LC-K | Hersteller : Samtec Inc. |
Description: .200 HI POWER SOCKET ASSEMBLYFeatures: Board Lock, Pick and Place Packaging: Tube Connector Type: Receptacle Mounting Type: Surface Mount Number of Positions: 3 Style: Board to Board Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.200" (5.08mm) Contact Finish - Mating: Tin Contact Finish - Post: Tin Insulation Height: 0.351" (8.92mm) Number of Rows: 1 |
Produkt ist nicht verfügbar |

