HPF-08-02-T-S-LC-K Samtec Inc.
Hersteller: Samtec Inc.
Description: .200 HI POWER SOCKET ASSEMBLY
Features: Board Lock, Pick and Place
Packaging: Tube
Connector Type: Receptacle
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.200" (5.08mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.351" (8.92mm)
Number of Rows: 1
Description: .200 HI POWER SOCKET ASSEMBLY
Features: Board Lock, Pick and Place
Packaging: Tube
Connector Type: Receptacle
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.200" (5.08mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.351" (8.92mm)
Number of Rows: 1
auf Bestellung 133 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 12.37 EUR |
| 10+ | 11.19 EUR |
| 100+ | 9.79 EUR |
Produktrezensionen
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Technische Details HPF-08-02-T-S-LC-K Samtec Inc.
Description: .200 HI POWER SOCKET ASSEMBLY, Features: Board Lock, Pick and Place, Packaging: Tube, Connector Type: Receptacle, Mounting Type: Surface Mount, Number of Positions: 8, Style: Board to Board, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Insulation Color: Black, Pitch - Mating: 0.200" (5.08mm), Contact Finish - Mating: Tin, Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.351" (8.92mm), Number of Rows: 1.
Weitere Produktangebote HPF-08-02-T-S-LC-K
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| HPF-08-02-T-S-LC-K | Hersteller : Samtec |
 Power to the Board .200" Power Socket Strip |
Produkt ist nicht verfügbar |