Technische Details HPM-02-02-T-S-RA Samtec
Description: CONN HEADER R/A 2POS 5.08MM, Packaging: Bulk, Connector Type: Header, Voltage Rating: 850VAC, 1200VDC, Mounting Type: Through Hole, Right Angle, Number of Positions: 2, Number of Rows: 1, Style: Board to Board, Operating Temperature: -55°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Copper Alloy, Insulation Color: Black, Pitch - Mating: 0.200" (5.08mm), Contact Finish - Mating: Tin, Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Contact Length - Post: 0.180" (4.57mm), Insulation Height: 0.100" (2.54mm), Shrouding: Unshrouded, Insulation Material: Polybutylene Terephthalate (PBT), Contact Length - Mating: 0.318" (8.08mm).
Weitere Produktangebote HPM-02-02-T-S-RA
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
|
|
HPM-02-02-T-S-RA | Hersteller : Samtec |
Conn Unshrouded Header HDR 2 POS 5.08mm Solder RA Thru-Hole Bulk |
Produkt ist nicht verfügbar |
|
|
HPM-02-02-T-S-RA | Hersteller : Samtec Inc. |
Description: CONN HEADER R/A 2POS 5.08MMPackaging: Bulk Connector Type: Header Voltage Rating: 850VAC, 1200VDC Mounting Type: Through Hole, Right Angle Number of Positions: 2 Number of Rows: 1 Style: Board to Board Operating Temperature: -55°C ~ 105°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Copper Alloy Insulation Color: Black Pitch - Mating: 0.200" (5.08mm) Contact Finish - Mating: Tin Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Contact Length - Post: 0.180" (4.57mm) Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Insulation Material: Polybutylene Terephthalate (PBT) Contact Length - Mating: 0.318" (8.08mm) |
Produkt ist nicht verfügbar |

