| Anzahl | Preis |
|---|---|
| 3+ | 1.18 EUR |
| 10+ | 1.13 EUR |
| 25+ | 1.08 EUR |
| 50+ | 1.05 EUR |
| 100+ | 1.03 EUR |
| 250+ | 0.96 EUR |
| 500+ | 0.9 EUR |
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Technische Details HSB01-080808 CUI Devices
Description: HEAT SINK, BGA, 8.5 X 8.5 X 8 MM, Packaging: Box, Material: Aluminum Alloy, Length: 0.335" (8.50mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.335" (8.50mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 1.9W @ 75°C, Thermal Resistance @ Forced Air Flow: 16.00°C/W @ 200 LFM, Thermal Resistance @ Natural: 39.10°C/W, Fin Height: 0.315" (8.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB01-080808 nach Preis ab 0.86 EUR bis 1.25 EUR
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HSB01-080808 | Hersteller : Same Sky |
 Heat Sinks heat sink, BGA, 8.5 x 8.5 x 8 mm |
auf Bestellung 3294 Stücke: Lieferzeit 10-14 Tag (e) |
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HSB01-080808 | Hersteller : Same Sky (Formerly CUI Devices) |
Description: HEAT SINK, BGA, 8.5 X 8.5 X 8 MM Packaging: Box Material: Aluminum Alloy Length: 0.335" (8.50mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.335" (8.50mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 1.9W @ 75°C Thermal Resistance @ Forced Air Flow: 16.00°C/W @ 200 LFM Thermal Resistance @ Natural: 39.10°C/W Fin Height: 0.315" (8.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 3081 Stücke: Lieferzeit 10-14 Tag (e) |
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| HSB01-080808 | Hersteller : Same Sky |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA; black; L: 8.5mm; W: 8.5mm; H: 8mm Length: 8.5mm Material: aluminium Type of heatsink: extruded Mounting: for back plate Heatsink shape: grilled Base thickness: 2mm Height: 8mm Width: 8.5mm Thermal resistance @200 LFM: 16°C/W Thermal resistance: max. 43.3°C/W Material finishing: anodized Application: BGA Colour: black |
Produkt ist nicht verfügbar |