| Anzahl | Privatkunde |
|---|---|
| 3+ | 1.4 EUR |
| 10+ | 1.34 EUR |
| 25+ | 1.29 EUR |
| 50+ | 1.25 EUR |
| 100+ | 1.23 EUR |
| 250+ | 1.14 EUR |
| 500+ | 1.07 EUR |
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Technische Details HSB01-080808 CUI Devices
Description: HEAT SINK, BGA, 8.5 X 8.5 X 8 MM, Packaging: Box, Material: Aluminum Alloy, Length: 0.335" (8.50mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.335" (8.50mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 1.9W @ 75°C, Thermal Resistance @ Forced Air Flow: 16.00°C/W @ 200 LFM, Thermal Resistance @ Natural: 39.10°C/W, Fin Height: 0.315" (8.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB01-080808 nach Preis ab 1 EUR bis 1.44 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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HSB01-080808 | Same Sky |
 Heat Sinks heat sink, BGA, 8.5 x 8.5 x 8 mm |
auf Bestellung 3255 Stücke: Lieferzeit 10-14 Tag (e) |
|
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HSB01-080808 | Same Sky (Formerly CUI Devices) |
Description: HEAT SINK, BGA, 8.5 X 8.5 X 8 MM Packaging: Box Material: Aluminum Alloy Length: 0.335" (8.50mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.335" (8.50mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 1.9W @ 75°C Thermal Resistance @ Forced Air Flow: 16.00°C/W @ 200 LFM Thermal Resistance @ Natural: 39.10°C/W Fin Height: 0.315" (8.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 2475 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSB01-080808 |
|
Hersteller: Same Sky
Heat Sinks heat sink, BGA, 8.5 x 8.5 x 8 mm
Heat Sinks heat sink, BGA, 8.5 x 8.5 x 8 mm
auf Bestellung 3255 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 1.43 EUR |
| 10+ | 1.25 EUR |
| 25+ | 1.19 EUR |
| 50+ | 1.18 EUR |
| 100+ | 1.14 EUR |
| 250+ | 1.05 EUR |
| 500+ | 1.02 EUR |
| HSB01-080808 |
|
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.335" (8.50mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.335" (8.50mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 1.9W @ 75°C
Thermal Resistance @ Forced Air Flow: 16.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 39.10°C/W
Fin Height: 0.315" (8.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.335" (8.50mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.335" (8.50mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 1.9W @ 75°C
Thermal Resistance @ Forced Air Flow: 16.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 39.10°C/W
Fin Height: 0.315" (8.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2475 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 15+ | 1.44 EUR |
| 17+ | 1.3 EUR |
| 25+ | 1.23 EUR |
| 50+ | 1.19 EUR |
| 100+ | 1.14 EUR |
| 315+ | 1.07 EUR |
| 630+ | 1.04 EUR |
| 1260+ | 1 EUR |