HSB01-080808 CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.335" (8.50mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.335" (8.50mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 1.9W @ 75°C
Thermal Resistance @ Forced Air Flow: 16.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 39.10°C/W
Fin Height: 0.315" (8.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 5117 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 15+ | 1.18 EUR |
| 500+ | 1.14 EUR |
| 1000+ | 1.03 EUR |
| 5000+ | 0.99 EUR |
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Technische Details HSB01-080808 CUI Devices
Description: HEAT SINK, BGA, 8.5 X 8.5 X 8 MM, Packaging: Box, Material: Aluminum Alloy, Length: 0.335" (8.50mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.335" (8.50mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 1.9W @ 75°C, Thermal Resistance @ Forced Air Flow: 16.00°C/W @ 200 LFM, Thermal Resistance @ Natural: 39.10°C/W, Fin Height: 0.315" (8.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB01-080808 nach Preis ab 1.34 EUR bis 1.74 EUR
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HSB01-080808 | Hersteller : CUI Devices |
Heat Sinks heat sink, BGA, 8.5 x 8.5 x 8 mm |
auf Bestellung 1797 Stücke: Lieferzeit 14-28 Tag (e) |
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