HSB02-101007 CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, BGA, 10 X 10 X 7 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.394" (10.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.394" (10.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 2.0W @ 75°C
Thermal Resistance @ Forced Air Flow: 16.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 37.90°C/W
Fin Height: 0.275" (7.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 6192 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 17+ | 1.04 EUR |
| 25+ | 0.99 EUR |
| 50+ | 0.96 EUR |
| 100+ | 0.95 EUR |
| 250+ | 0.88 EUR |
| 500+ | 0.83 EUR |
| 1000+ | 0.75 EUR |
| 5000+ | 0.73 EUR |
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Technische Details HSB02-101007 CUI Devices
Description: HEAT SINK, BGA, 10 X 10 X 7 MM, Packaging: Box, Material: Aluminum Alloy, Length: 0.394" (10.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.394" (10.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 2.0W @ 75°C, Thermal Resistance @ Forced Air Flow: 16.50°C/W @ 200 LFM, Thermal Resistance @ Natural: 37.90°C/W, Fin Height: 0.275" (7.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB02-101007 nach Preis ab 1.26 EUR bis 1.62 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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HSB02-101007 | Hersteller : CUI Devices |
Heat Sinks heat sink, BGA, 10 x 10 x 7 mm |
auf Bestellung 7226 Stücke: Lieferzeit 14-28 Tag (e) |
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| HSB02-101007 | Hersteller : CUI DEVICES |
10 x 10 mm, BGA Heat Sink, Aluminum, PCB |
auf Bestellung 3672 Stücke: Lieferzeit 14-21 Tag (e) |