| Anzahl | Privatkunde |
|---|---|
| 3+ | 1.26 EUR |
| 10+ | 1.12 EUR |
| 25+ | 1.09 EUR |
| 100+ | 1.05 EUR |
| 266+ | 1 EUR |
| 532+ | 0.94 EUR |
| 1064+ | 0.92 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details HSB02-101007 Same Sky
Description: HEAT SINK, BGA, 10 X 10 X 7 MM, Packaging: Box, Material: Aluminum Alloy, Length: 0.394" (10.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.394" (10.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 2.0W @ 75°C, Thermal Resistance @ Forced Air Flow: 16.50°C/W @ 200 LFM, Thermal Resistance @ Natural: 37.90°C/W, Fin Height: 0.275" (7.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB02-101007 nach Preis ab 0.93 EUR bis 1.34 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
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HSB02-101007 | CUI Devices |
 Heat Sinks heat sink, BGA, 10 x 10 x 7 mm |
auf Bestellung 5203 Stücke: Lieferzeit 10-14 Tag (e) |
|
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HSB02-101007 | Same Sky (Formerly CUI Devices) |
Description: HEAT SINK, BGA, 10 X 10 X 7 MM Packaging: Box Material: Aluminum Alloy Length: 0.394" (10.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.394" (10.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 2.0W @ 75°C Thermal Resistance @ Forced Air Flow: 16.50°C/W @ 200 LFM Thermal Resistance @ Natural: 37.90°C/W Fin Height: 0.275" (7.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 3351 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSB02-101007 |
|
Hersteller: CUI Devices
Heat Sinks heat sink, BGA, 10 x 10 x 7 mm
Heat Sinks heat sink, BGA, 10 x 10 x 7 mm
auf Bestellung 5203 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 1.31 EUR |
| 10+ | 1.23 EUR |
| 25+ | 1.17 EUR |
| 50+ | 1.14 EUR |
| 100+ | 1.13 EUR |
| 250+ | 1.05 EUR |
| 500+ | 1 EUR |
| HSB02-101007 |
|
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 10 X 10 X 7 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.394" (10.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.394" (10.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 2.0W @ 75°C
Thermal Resistance @ Forced Air Flow: 16.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 37.90°C/W
Fin Height: 0.275" (7.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK, BGA, 10 X 10 X 7 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.394" (10.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.394" (10.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 2.0W @ 75°C
Thermal Resistance @ Forced Air Flow: 16.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 37.90°C/W
Fin Height: 0.275" (7.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 3351 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 16+ | 1.34 EUR |
| 18+ | 1.19 EUR |
| 25+ | 1.13 EUR |
| 50+ | 1.09 EUR |
| 100+ | 1.05 EUR |
| 266+ | 1 EUR |
| 532+ | 0.96 EUR |
| 1064+ | 0.93 EUR |