auf Bestellung 922 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 1.04 EUR |
| 10+ | 0.94 EUR |
| 25+ | 0.89 EUR |
| 50+ | 0.86 EUR |
| 100+ | 0.83 EUR |
| 250+ | 0.79 EUR |
| 500+ | 0.76 EUR |
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Technische Details HSB02-101007 Same Sky
Description: HEAT SINK, BGA, 10 X 10 X 7 MM, Packaging: Box, Material: Aluminum Alloy, Length: 0.394" (10.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.394" (10.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 2.0W @ 75°C, Thermal Resistance @ Forced Air Flow: 16.50°C/W @ 200 LFM, Thermal Resistance @ Natural: 37.90°C/W, Fin Height: 0.275" (7.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB02-101007 nach Preis ab 0.7 EUR bis 1.1 EUR
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HSB02-101007 | Hersteller : Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 10 X 10 X 7 MMPackaging: Box Material: Aluminum Alloy Length: 0.394" (10.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.394" (10.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 2.0W @ 75°C Thermal Resistance @ Forced Air Flow: 16.50°C/W @ 200 LFM Thermal Resistance @ Natural: 37.90°C/W Fin Height: 0.275" (7.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 4509 Stücke: Lieferzeit 10-14 Tag (e) |
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HSB02-101007 | Hersteller : CUI Devices |
Heat Sinks heat sink, BGA, 10 x 10 x 7 mm |
auf Bestellung 5203 Stücke: Lieferzeit 10-14 Tag (e) |
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| HSB02-101007 | Hersteller : CUI DEVICES |
10 x 10 mm, BGA Heat Sink, Aluminum, PCB |
auf Bestellung 3672 Stücke: Lieferzeit 14-21 Tag (e) |