auf Bestellung 4665 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 1.44 EUR |
| 10+ | 1.3 EUR |
| 25+ | 1.23 EUR |
| 50+ | 1.2 EUR |
| 100+ | 1.15 EUR |
| 250+ | 1.07 EUR |
| 500+ | 1.05 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details HSB03-121218 Same Sky
Description: HEAT SINK, BGA, 12 X 12 X 18 MM, Packaging: Tray, Material: Aluminum Alloy, Length: 0.472" (12.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.472" (12.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 3.1W @ 75°C, Thermal Resistance @ Forced Air Flow: 9.60°C/W @ 200 LFM, Thermal Resistance @ Natural: 24.01°C/W, Fin Height: 0.709" (18.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB03-121218 nach Preis ab 1.04 EUR bis 1.57 EUR
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HSB03-121218 | Hersteller : CUI Devices |
 Heat Sinks heat sink, BGA, 12 x 12 x 18 mm |
auf Bestellung 4170 Stücke: Lieferzeit 10-14 Tag (e) |
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HSB03-121218 | Hersteller : Same Sky (Formerly CUI Devices) |
Description: HEAT SINK, BGA, 12 X 12 X 18 MM Packaging: Tray Material: Aluminum Alloy Length: 0.472" (12.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.472" (12.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 3.1W @ 75°C Thermal Resistance @ Forced Air Flow: 9.60°C/W @ 200 LFM Thermal Resistance @ Natural: 24.01°C/W Fin Height: 0.709" (18.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1432 Stücke: Lieferzeit 10-14 Tag (e) |
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| HSB03-121218 | Hersteller : CUI DEVICES |
12 x 12 mm, BGA Heat Sink, Aluminum, PCB |
auf Bestellung 2520 Stücke: Lieferzeit 14-21 Tag (e) |