auf Bestellung 5784 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 1.06 EUR |
| 10+ | 0.98 EUR |
| 50+ | 0.96 EUR |
| 100+ | 0.94 EUR |
| 250+ | 0.87 EUR |
| 500+ | 0.85 EUR |
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Technische Details HSB03-141406 Same Sky
Description: HEAT SINK, BGA, 14 X 14 X 6 MM, Packaging: Box, Material: Aluminum Alloy, Length: 0.551" (14.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.551" (14.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 2.1W @ 75°C, Thermal Resistance @ Forced Air Flow: 15.80°C/W @ 200 LFM, Thermal Resistance @ Natural: 35.98°C/W, Fin Height: 0.236" (6.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB03-141406 nach Preis ab 0.94 EUR bis 1.3 EUR
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HSB03-141406 | Hersteller : Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 14 X 14 X 6 MMPackaging: Box Material: Aluminum Alloy Length: 0.551" (14.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.551" (14.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 2.1W @ 75°C Thermal Resistance @ Forced Air Flow: 15.80°C/W @ 200 LFM Thermal Resistance @ Natural: 35.98°C/W Fin Height: 0.236" (6.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 3208 Stücke: Lieferzeit 10-14 Tag (e) |
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| HSB03-141406 | Hersteller : CUI DEVICES |
Heat Sink Passive BGA Vertical SMD Aluminum 6063-T5 15.8C/W Black Anodized |
auf Bestellung 3672 Stücke: Lieferzeit 14-21 Tag (e) |