| Anzahl | Privatkunde |
|---|---|
| 3+ | 1.48 EUR |
| 10+ | 1.3 EUR |
| 25+ | 1.24 EUR |
| 50+ | 1.19 EUR |
| 100+ | 1.13 EUR |
| 192+ | 1.07 EUR |
| 576+ | 1.06 EUR |
Produktrezensionen
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Technische Details HSB03-141406 Same Sky
Description: HEAT SINK, BGA, 14 X 14 X 6 MM, Packaging: Box, Material: Aluminum Alloy, Length: 0.551" (14.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.551" (14.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 2.1W @ 75°C, Thermal Resistance @ Forced Air Flow: 15.80°C/W @ 200 LFM, Thermal Resistance @ Natural: 35.98°C/W, Fin Height: 0.236" (6.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB03-141406 nach Preis ab 1.04 EUR bis 1.51 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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HSB03-141406 | Same Sky (Formerly CUI Devices) |
Description: HEAT SINK, BGA, 14 X 14 X 6 MMPackaging: Box Material: Aluminum Alloy Length: 0.551" (14.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.551" (14.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 2.1W @ 75°C Thermal Resistance @ Forced Air Flow: 15.80°C/W @ 200 LFM Thermal Resistance @ Natural: 35.98°C/W Fin Height: 0.236" (6.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1348 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSB03-141406 |
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Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 14 X 14 X 6 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.551" (14.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.551" (14.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 2.1W @ 75°C
Thermal Resistance @ Forced Air Flow: 15.80°C/W @ 200 LFM
Thermal Resistance @ Natural: 35.98°C/W
Fin Height: 0.236" (6.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK, BGA, 14 X 14 X 6 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.551" (14.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.551" (14.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 2.1W @ 75°C
Thermal Resistance @ Forced Air Flow: 15.80°C/W @ 200 LFM
Thermal Resistance @ Natural: 35.98°C/W
Fin Height: 0.236" (6.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1348 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 14+ | 1.51 EUR |
| 16+ | 1.33 EUR |
| 25+ | 1.27 EUR |
| 50+ | 1.23 EUR |
| 192+ | 1.14 EUR |
| 384+ | 1.11 EUR |
| 576+ | 1.08 EUR |
| 1152+ | 1.04 EUR |



