HSB05-171711 Same Sky (Formerly CUI Devices)
Hersteller: Same Sky (Formerly CUI Devices)Description: HEAT SINK, BGA, 17 X 17 X 11.5 M
Packaging: Box
Material: Aluminum Alloy
Length: 0.669" (17.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.669" (17.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 3.1W @ 75°C
Thermal Resistance @ Forced Air Flow: 8.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.91°C/W
Fin Height: 0.453" (11.50mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1244 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 11+ | 1.74 EUR |
| 12+ | 1.53 EUR |
| 25+ | 1.46 EUR |
| 50+ | 1.41 EUR |
| 100+ | 1.36 EUR |
| 250+ | 1.29 EUR |
| 500+ | 1.25 EUR |
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Technische Details HSB05-171711 Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 17 X 17 X 11.5 M, Packaging: Box, Material: Aluminum Alloy, Length: 0.669" (17.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.669" (17.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 3.1W @ 75°C, Thermal Resistance @ Forced Air Flow: 8.40°C/W @ 200 LFM, Thermal Resistance @ Natural: 23.91°C/W, Fin Height: 0.453" (11.50mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB05-171711 nach Preis ab 1.33 EUR bis 1.78 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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HSB05-171711 | Hersteller : CUI Devices |
Heat Sinks heat sink, BGA, 17 x 17 x 11.5 mm |
auf Bestellung 1534 Stücke: Lieferzeit 10-14 Tag (e) |
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| HSB05-171711 | Hersteller : CUI DEVICES |
17 x 17 mm, BGA Heat Sink, Aluminum, PCB |
Produkt ist nicht verfügbar |