| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.12 EUR |
| 10+ | 1.86 EUR |
| 25+ | 1.8 EUR |
| 50+ | 1.75 EUR |
| 100+ | 1.65 EUR |
| 260+ | 1.56 EUR |
| 520+ | 1.5 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details HSB05-171711 Same Sky
Description: HEAT SINK, BGA, 17 X 17 X 11.5 M, Packaging: Box, Material: Aluminum Alloy, Length: 0.669" (17.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.669" (17.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 3.1W @ 75°C, Thermal Resistance @ Forced Air Flow: 8.40°C/W @ 200 LFM, Thermal Resistance @ Natural: 23.91°C/W, Fin Height: 0.453" (11.50mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB05-171711 nach Preis ab 1.56 EUR bis 2.26 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
HSB05-171711 | CUI Devices |
 Heat Sinks heat sink, BGA, 17 x 17 x 11.5 mm |
auf Bestellung 1534 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
HSB05-171711 | Same Sky (Formerly CUI Devices) |
Description: HEAT SINK, BGA, 17 X 17 X 11.5 M Packaging: Box Material: Aluminum Alloy Length: 0.669" (17.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.669" (17.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 3.1W @ 75°C Thermal Resistance @ Forced Air Flow: 8.40°C/W @ 200 LFM Thermal Resistance @ Natural: 23.91°C/W Fin Height: 0.453" (11.50mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1569 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSB05-171711 |
|
Hersteller: CUI Devices
Heat Sinks heat sink, BGA, 17 x 17 x 11.5 mm
Heat Sinks heat sink, BGA, 17 x 17 x 11.5 mm
auf Bestellung 1534 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.12 EUR |
| 10+ | 1.99 EUR |
| 25+ | 1.95 EUR |
| 50+ | 1.89 EUR |
| 100+ | 1.78 EUR |
| 250+ | 1.69 EUR |
| 500+ | 1.58 EUR |
| HSB05-171711 |
|
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 17 X 17 X 11.5 M
Packaging: Box
Material: Aluminum Alloy
Length: 0.669" (17.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.669" (17.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 3.1W @ 75°C
Thermal Resistance @ Forced Air Flow: 8.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.91°C/W
Fin Height: 0.453" (11.50mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK, BGA, 17 X 17 X 11.5 M
Packaging: Box
Material: Aluminum Alloy
Length: 0.669" (17.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.669" (17.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 3.1W @ 75°C
Thermal Resistance @ Forced Air Flow: 8.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.91°C/W
Fin Height: 0.453" (11.50mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1569 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 10+ | 2.26 EUR |
| 11+ | 2 EUR |
| 25+ | 1.9 EUR |
| 50+ | 1.83 EUR |
| 130+ | 1.74 EUR |
| 260+ | 1.68 EUR |
| 520+ | 1.62 EUR |
| 1040+ | 1.56 EUR |