auf Bestellung 1534 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 1.78 EUR |
| 10+ | 1.67 EUR |
| 25+ | 1.64 EUR |
| 50+ | 1.59 EUR |
| 100+ | 1.5 EUR |
| 250+ | 1.42 EUR |
| 500+ | 1.33 EUR |
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Technische Details HSB05-171711 CUI Devices
Description: HEAT SINK, BGA, 17 X 17 X 11.5 M, Packaging: Box, Material: Aluminum Alloy, Length: 0.669" (17.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.669" (17.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 3.1W @ 75°C, Thermal Resistance @ Forced Air Flow: 8.40°C/W @ 200 LFM, Thermal Resistance @ Natural: 23.91°C/W, Fin Height: 0.453" (11.50mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB05-171711 nach Preis ab 1.29 EUR bis 1.87 EUR
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HSB05-171711 | Hersteller : Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 17 X 17 X 11.5 MPackaging: Box Material: Aluminum Alloy Length: 0.669" (17.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.669" (17.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 3.1W @ 75°C Thermal Resistance @ Forced Air Flow: 8.40°C/W @ 200 LFM Thermal Resistance @ Natural: 23.91°C/W Fin Height: 0.453" (11.50mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 2460 Stücke: Lieferzeit 10-14 Tag (e) |
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