| Anzahl | Privatkunde |
|---|---|
| 2+ | 1.99 EUR |
| 10+ | 1.86 EUR |
| 25+ | 1.81 EUR |
| 50+ | 1.76 EUR |
| 100+ | 1.67 EUR |
| 250+ | 1.62 EUR |
| 500+ | 1.51 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
Mindestmenge:
2 Stücke
Produktrezensionen
Produktbewertung abgeben
Technische Details HSB06-181810 CUI Devices
Description: HEAT SINK, BGA, 18 X 18 X 10 MM, Packaging: Box, Material: Aluminum Alloy, Length: 0.709" (18.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.709" (18.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 3.2W @ 75°C, Thermal Resistance @ Forced Air Flow: 18.80°C/W @ 200 LFM, Thermal Resistance @ Natural: 23.68°C/W, Fin Height: 0.394" (10.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB06-181810 nach Preis ab 1.44 EUR bis 2.07 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
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HSB06-181810 | Same Sky |
 Heat Sinks heat sink, BGA, 18 x 18 x 10 mm |
auf Bestellung 1839 Stücke: Lieferzeit 10-14 Tag (e) |
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HSB06-181810 | Same Sky (Formerly CUI Devices) |
Description: HEAT SINK, BGA, 18 X 18 X 10 MM Packaging: Box Material: Aluminum Alloy Length: 0.709" (18.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.709" (18.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 3.2W @ 75°C Thermal Resistance @ Forced Air Flow: 18.80°C/W @ 200 LFM Thermal Resistance @ Natural: 23.68°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1544 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSB06-181810 |
|
Hersteller: Same Sky
Heat Sinks heat sink, BGA, 18 x 18 x 10 mm
Heat Sinks heat sink, BGA, 18 x 18 x 10 mm
auf Bestellung 1839 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.05 EUR |
| 10+ | 1.82 EUR |
| 25+ | 1.76 EUR |
| 50+ | 1.69 EUR |
| 117+ | 1.62 EUR |
| 234+ | 1.48 EUR |
| 585+ | 1.45 EUR |
| HSB06-181810 |
|
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 18 X 18 X 10 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.709" (18.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.709" (18.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 3.2W @ 75°C
Thermal Resistance @ Forced Air Flow: 18.80°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.68°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK, BGA, 18 X 18 X 10 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.709" (18.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.709" (18.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 3.2W @ 75°C
Thermal Resistance @ Forced Air Flow: 18.80°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.68°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1544 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 11+ | 2.07 EUR |
| 12+ | 1.84 EUR |
| 25+ | 1.75 EUR |
| 50+ | 1.69 EUR |
| 117+ | 1.62 EUR |
| 351+ | 1.52 EUR |
| 585+ | 1.49 EUR |
| 1053+ | 1.44 EUR |