| Anzahl | Privatkunde |
|---|---|
| 2+ | 1.96 EUR |
| 10+ | 1.73 EUR |
| 25+ | 1.65 EUR |
| 50+ | 1.54 EUR |
| 100+ | 1.46 EUR |
| 187+ | 1.38 EUR |
| 561+ | 1.33 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
Mindestmenge:
2 Stücke
Produktrezensionen
Produktbewertung abgeben
Technische Details HSB08-212106 Same Sky
Description: HEAT SINK, BGA, 21 X 21 X 6 MM, Packaging: Box, Material: Aluminum Alloy, Length: 0.827" (21.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.827" (21.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 3.0W @ 75°C, Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM, Thermal Resistance @ Natural: 25.40°C/W, Fin Height: 0.236" (6.00mm), Material Finish: Black Anodized.
Weitere Produktangebote HSB08-212106 nach Preis ab 1.54 EUR bis 2.23 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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HSB08-212106 | Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 21 X 21 X 6 MMPackaging: Box Material: Aluminum Alloy Length: 0.827" (21.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.827" (21.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 3.0W @ 75°C Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM Thermal Resistance @ Natural: 25.40°C/W Fin Height: 0.236" (6.00mm) Material Finish: Black Anodized |
auf Bestellung 1967 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSB08-212106 |
|
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 21 X 21 X 6 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.827" (21.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.827" (21.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 3.0W @ 75°C
Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 25.40°C/W
Fin Height: 0.236" (6.00mm)
Material Finish: Black Anodized
Description: HEAT SINK, BGA, 21 X 21 X 6 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.827" (21.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.827" (21.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 3.0W @ 75°C
Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 25.40°C/W
Fin Height: 0.236" (6.00mm)
Material Finish: Black Anodized
auf Bestellung 1967 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 10+ | 2.23 EUR |
| 11+ | 1.96 EUR |
| 25+ | 1.88 EUR |
| 50+ | 1.81 EUR |
| 187+ | 1.69 EUR |
| 374+ | 1.63 EUR |
| 561+ | 1.59 EUR |
| 1122+ | 1.54 EUR |