HSB08-212106 CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, BGA, 21 X 21 X 6 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.827" (21.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.827" (21.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 3.0W @ 75°C
Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 25.40°C/W
Fin Height: 0.236" (6.00mm)
Material Finish: Black Anodized
auf Bestellung 2093 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 13+ | 1.39 EUR |
| 25+ | 1.32 EUR |
| 50+ | 1.28 EUR |
| 100+ | 1.26 EUR |
| 250+ | 1.18 EUR |
| 500+ | 1.11 EUR |
| 1872+ | 1.00 EUR |
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Technische Details HSB08-212106 CUI Devices
Description: HEAT SINK, BGA, 21 X 21 X 6 MM, Packaging: Box, Material: Aluminum Alloy, Length: 0.827" (21.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.827" (21.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 3.0W @ 75°C, Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM, Thermal Resistance @ Natural: 25.40°C/W, Fin Height: 0.236" (6.00mm), Material Finish: Black Anodized.
Weitere Produktangebote HSB08-212106 nach Preis ab 1.09 EUR bis 1.44 EUR
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HSB08-212106 | Hersteller : CUI Devices |
Heat Sinks heat sink, BGA, 21 x 21 x 6 mm |
auf Bestellung 3005 Stücke: Lieferzeit 10-14 Tag (e) |
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| HSB08-212106 | Hersteller : Same Sky |
HSB08-212106 Heatsinks |
Produkt ist nicht verfügbar |