| Anzahl | Privatkunde |
|---|---|
| 3+ | 1.64 EUR |
| 10+ | 1.45 EUR |
| 25+ | 1.24 EUR |
| 50+ | 1.21 EUR |
| 100+ | 1.15 EUR |
| 250+ | 1.11 EUR |
| 500+ | 1.08 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details HSB08-212106 Same Sky
Description: HEAT SINK, BGA, 21 X 21 X 6 MM, Material Finish: Black Anodized, Fin Height: 0.236" (6.00mm), Thermal Resistance @ Natural: 25.40°C/W, Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM, Power Dissipation @ Temperature Rise: 3.0W @ 75°C, Attachment Method: Adhesive (Not Included), Package Cooled: BGA, Width: 0.827" (21.00mm), Type: Top Mount, Shape: Square, Pin Fins, Length: 0.827" (21.00mm), Material: Aluminum Alloy, Packaging: Box.
Weitere Produktangebote HSB08-212106 nach Preis ab 1.3 EUR bis 2.23 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
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HSB08-212106 | CUI Devices |
 Heat Sinks heat sink, BGA, 21 x 21 x 6 mm |
auf Bestellung 3005 Stücke: Lieferzeit 10-14 Tag (e) |
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HSB08-212106 | Same Sky (Formerly CUI Devices) |
Description: HEAT SINK, BGA, 21 X 21 X 6 MM Material Finish: Black Anodized Fin Height: 0.236" (6.00mm) Thermal Resistance @ Natural: 25.40°C/W Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM Power Dissipation @ Temperature Rise: 3.0W @ 75°C Attachment Method: Adhesive (Not Included) Package Cooled: BGA Width: 0.827" (21.00mm) Type: Top Mount Shape: Square, Pin Fins Length: 0.827" (21.00mm) Material: Aluminum Alloy Packaging: Box |
auf Bestellung 2072 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSB08-212106 |
|
Hersteller: CUI Devices
Heat Sinks heat sink, BGA, 21 x 21 x 6 mm
Heat Sinks heat sink, BGA, 21 x 21 x 6 mm
auf Bestellung 3005 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 1.71 EUR |
| 10+ | 1.63 EUR |
| 25+ | 1.56 EUR |
| 50+ | 1.52 EUR |
| 100+ | 1.5 EUR |
| 250+ | 1.36 EUR |
| 500+ | 1.3 EUR |
| HSB08-212106 |
|
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 21 X 21 X 6 MM
Material Finish: Black Anodized
Fin Height: 0.236" (6.00mm)
Thermal Resistance @ Natural: 25.40°C/W
Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 75°C
Attachment Method: Adhesive (Not Included)
Package Cooled: BGA
Width: 0.827" (21.00mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 0.827" (21.00mm)
Material: Aluminum Alloy
Packaging: Box
Description: HEAT SINK, BGA, 21 X 21 X 6 MM
Material Finish: Black Anodized
Fin Height: 0.236" (6.00mm)
Thermal Resistance @ Natural: 25.40°C/W
Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 75°C
Attachment Method: Adhesive (Not Included)
Package Cooled: BGA
Width: 0.827" (21.00mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 0.827" (21.00mm)
Material: Aluminum Alloy
Packaging: Box
auf Bestellung 2072 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 10+ | 2.23 EUR |
| 11+ | 1.98 EUR |
| 25+ | 1.88 EUR |
| 50+ | 1.81 EUR |
| 187+ | 1.69 EUR |
| 374+ | 1.63 EUR |
| 561+ | 1.59 EUR |
| 1122+ | 1.54 EUR |