auf Bestellung 2226 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 1.99 EUR |
| 10+ | 1.8 EUR |
| 25+ | 1.71 EUR |
| 50+ | 1.66 EUR |
| 100+ | 1.61 EUR |
| 250+ | 1.49 EUR |
| 500+ | 1.43 EUR |
Produktrezensionen
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Technische Details HSB11-252518 Same Sky
Description: HEAT SINK, BGA, 25 X 25 X 18 MM, Packaging: Box, Material: Aluminum Alloy, Length: 0.984" (25.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.984" (25.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 5.5W @ 75°C, Thermal Resistance @ Forced Air Flow: 4.50°C/W @ 200 LFM, Thermal Resistance @ Natural: 13.70°C/W, Fin Height: 0.709" (18.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB11-252518 nach Preis ab 1.37 EUR bis 2.09 EUR
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HSB11-252518 | Hersteller : Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 25 X 25 X 18 MMPackaging: Box Material: Aluminum Alloy Length: 0.984" (25.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.984" (25.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 5.5W @ 75°C Thermal Resistance @ Forced Air Flow: 4.50°C/W @ 200 LFM Thermal Resistance @ Natural: 13.70°C/W Fin Height: 0.709" (18.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 2088 Stücke: Lieferzeit 10-14 Tag (e) |
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HSB11-252518 | Hersteller : CUI Devices |
Heat Sinks heat sink, BGA, 25 x 25 x 18 mm |
auf Bestellung 5659 Stücke: Lieferzeit 10-14 Tag (e) |
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| HSB11-252518 | Hersteller : CUI DEVICES |
25 x 25 mm, BGA Heat Sink, Aluminum, PCB |
Produkt ist nicht verfügbar |