| Anzahl | Preis |
|---|---|
| 2+ | 1.41 EUR |
| 10+ | 1.34 EUR |
| 50+ | 1.29 EUR |
| 100+ | 1.19 EUR |
| 252+ | 1.03 EUR |
| 504+ | 0.99 EUR |
| 1008+ | 0.96 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details HSB12-272706 Same Sky
Description: HEAT SINK, BGA, 27 X 27 X 6 MM, Packaging: Box, Part Status: Active, Material Finish: Black Anodized, Fin Height: 0.236" (6.00mm), Thermal Resistance @ Natural: 19.59°C/W, Thermal Resistance @ Forced Air Flow: 7.80°C/W @ 200 LFM, Power Dissipation @ Temperature Rise: 3.8W @ 75°C, Attachment Method: Adhesive (Not Included), Package Cooled: BGA, Width: 1.063" (27.00mm), Type: Top Mount, Shape: Square, Pin Fins, Length: 1.063" (27.00mm), Material: Aluminum Alloy.
Weitere Produktangebote HSB12-272706 nach Preis ab 1.09 EUR bis 1.53 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
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HSB12-272706 | CUI Devices |
 Heat Sinks heat sink, BGA, 27 x 27 x 6 mm |
auf Bestellung 238 Stücke: Lieferzeit 10-14 Tag (e) |
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HSB12-272706 | Same Sky (Formerly CUI Devices) |
Description: HEAT SINK, BGA, 27 X 27 X 6 MM Packaging: Box Part Status: Active Material Finish: Black Anodized Fin Height: 0.236" (6.00mm) Thermal Resistance @ Natural: 19.59°C/W Thermal Resistance @ Forced Air Flow: 7.80°C/W @ 200 LFM Power Dissipation @ Temperature Rise: 3.8W @ 75°C Attachment Method: Adhesive (Not Included) Package Cooled: BGA Width: 1.063" (27.00mm) Type: Top Mount Shape: Square, Pin Fins Length: 1.063" (27.00mm) Material: Aluminum Alloy |
auf Bestellung 1101 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSB12-272706 |
|
Hersteller: CUI Devices
Heat Sinks heat sink, BGA, 27 x 27 x 6 mm
Heat Sinks heat sink, BGA, 27 x 27 x 6 mm
auf Bestellung 238 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 1.44 EUR |
| 10+ | 1.37 EUR |
| 25+ | 1.3 EUR |
| 50+ | 1.27 EUR |
| 100+ | 1.25 EUR |
| 250+ | 1.16 EUR |
| 500+ | 1.09 EUR |
| HSB12-272706 |
|
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 27 X 27 X 6 MM
Packaging: Box
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.236" (6.00mm)
Thermal Resistance @ Natural: 19.59°C/W
Thermal Resistance @ Forced Air Flow: 7.80°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 3.8W @ 75°C
Attachment Method: Adhesive (Not Included)
Package Cooled: BGA
Width: 1.063" (27.00mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 1.063" (27.00mm)
Material: Aluminum Alloy
Description: HEAT SINK, BGA, 27 X 27 X 6 MM
Packaging: Box
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.236" (6.00mm)
Thermal Resistance @ Natural: 19.59°C/W
Thermal Resistance @ Forced Air Flow: 7.80°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 3.8W @ 75°C
Attachment Method: Adhesive (Not Included)
Package Cooled: BGA
Width: 1.063" (27.00mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 1.063" (27.00mm)
Material: Aluminum Alloy
auf Bestellung 1101 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 12+ | 1.53 EUR |
| 13+ | 1.36 EUR |
| 25+ | 1.3 EUR |
| 50+ | 1.25 EUR |
| 100+ | 1.2 EUR |
| 250+ | 1.15 EUR |
| 500+ | 1.11 EUR |