auf Bestellung 198 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 1.41 EUR |
| 10+ | 1.34 EUR |
| 50+ | 1.29 EUR |
| 100+ | 1.19 EUR |
| 252+ | 1.03 EUR |
| 504+ | 0.99 EUR |
| 1008+ | 0.96 EUR |
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Technische Details HSB12-272706 Same Sky
Description: HEAT SINK, BGA, 27 X 27 X 6 MM, Packaging: Box, Material: Aluminum Alloy, Length: 1.063" (27.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.063" (27.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 3.8W @ 75°C, Thermal Resistance @ Forced Air Flow: 7.80°C/W @ 200 LFM, Thermal Resistance @ Natural: 19.59°C/W, Fin Height: 0.236" (6.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB12-272706 nach Preis ab 1.09 EUR bis 1.53 EUR
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HSB12-272706 | Hersteller : CUI Devices |
 Heat Sinks heat sink, BGA, 27 x 27 x 6 mm |
auf Bestellung 238 Stücke: Lieferzeit 10-14 Tag (e) |
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HSB12-272706 | Hersteller : Same Sky (Formerly CUI Devices) |
Description: HEAT SINK, BGA, 27 X 27 X 6 MM Packaging: Box Material: Aluminum Alloy Length: 1.063" (27.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.063" (27.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 3.8W @ 75°C Thermal Resistance @ Forced Air Flow: 7.80°C/W @ 200 LFM Thermal Resistance @ Natural: 19.59°C/W Fin Height: 0.236" (6.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1101 Stücke: Lieferzeit 10-14 Tag (e) |
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