HSB12-272706 CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, BGA, 27 X 27 X 6 MM
Packaging: Box
Material: Aluminum Alloy
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Adhesive
Power Dissipation @ Temperature Rise: 3.8W @ 75°C
Thermal Resistance @ Forced Air Flow: 7.80°C/W @ 200 LFM
Thermal Resistance @ Natural: 19.59°C/W
Fin Height: 0.236" (6.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1293 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 13+ | 1.7 EUR |
| 25+ | 1.61 EUR |
| 50+ | 1.57 EUR |
| 100+ | 1.55 EUR |
| 250+ | 1.44 EUR |
| 500+ | 1.36 EUR |
| 1000+ | 1.23 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details HSB12-272706 CUI Devices
Description: HEAT SINK, BGA, 27 X 27 X 6 MM, Packaging: Box, Material: Aluminum Alloy, Length: 1.063" (27.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.063" (27.00mm), Package Cooled: BGA, Attachment Method: Adhesive, Power Dissipation @ Temperature Rise: 3.8W @ 75°C, Thermal Resistance @ Forced Air Flow: 7.80°C/W @ 200 LFM, Thermal Resistance @ Natural: 19.59°C/W, Fin Height: 0.236" (6.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB12-272706 nach Preis ab 1.62 EUR bis 2.13 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
HSB12-272706 | Hersteller : CUI Devices |
Heat Sinks heat sink, BGA, 27 x 27 x 6 mm |
auf Bestellung 484 Stücke: Lieferzeit 14-28 Tag (e) |
|