| Anzahl | Preis |
|---|---|
| 2+ | 2.22 EUR |
| 10+ | 2.09 EUR |
| 25+ | 2.06 EUR |
| 50+ | 2.01 EUR |
| 100+ | 1.88 EUR |
| 250+ | 1.78 EUR |
| 500+ | 1.65 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details HSB13-303014 CUI Devices
Description: HEAT SINK, BGA, 30.7 X 30.7 X 14, Part Status: Active, Material Finish: Black Anodized, Fin Height: 0.551" (14.00mm), Thermal Resistance @ Natural: 12.36°C/W, Thermal Resistance @ Forced Air Flow: 4.70°C/W @ 200 LFM, Power Dissipation @ Temperature Rise: 6.1W @ 75°C, Attachment Method: Adhesive (Not Included), Package Cooled: BGA, Width: 1.209" (30.70mm), Type: Top Mount, Shape: Square, Pin Fins, Length: 1.209" (30.70mm), Material: Aluminum Alloy, Packaging: Box.
Weitere Produktangebote HSB13-303014 nach Preis ab 1.72 EUR bis 2.31 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
HSB13-303014 | Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 30.7 X 30.7 X 14Part Status: Active Material Finish: Black Anodized Fin Height: 0.551" (14.00mm) Thermal Resistance @ Natural: 12.36°C/W Thermal Resistance @ Forced Air Flow: 4.70°C/W @ 200 LFM Power Dissipation @ Temperature Rise: 6.1W @ 75°C Attachment Method: Adhesive (Not Included) Package Cooled: BGA Width: 1.209" (30.70mm) Type: Top Mount Shape: Square, Pin Fins Length: 1.209" (30.70mm) Material: Aluminum Alloy Packaging: Box |
auf Bestellung 260 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSB13-303014 |
|
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 30.7 X 30.7 X 14
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.551" (14.00mm)
Thermal Resistance @ Natural: 12.36°C/W
Thermal Resistance @ Forced Air Flow: 4.70°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 6.1W @ 75°C
Attachment Method: Adhesive (Not Included)
Package Cooled: BGA
Width: 1.209" (30.70mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 1.209" (30.70mm)
Material: Aluminum Alloy
Packaging: Box
Description: HEAT SINK, BGA, 30.7 X 30.7 X 14
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.551" (14.00mm)
Thermal Resistance @ Natural: 12.36°C/W
Thermal Resistance @ Forced Air Flow: 4.70°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 6.1W @ 75°C
Attachment Method: Adhesive (Not Included)
Package Cooled: BGA
Width: 1.209" (30.70mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 1.209" (30.70mm)
Material: Aluminum Alloy
Packaging: Box
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 8+ | 2.31 EUR |
| 10+ | 2.04 EUR |
| 25+ | 1.95 EUR |
| 50+ | 1.88 EUR |
| 100+ | 1.81 EUR |
| 250+ | 1.72 EUR |