HSB13-303014 CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, BGA, 30.7 X 30.7 X 14
Packaging: Box
Material: Aluminum Alloy
Length: 1.209" (30.70mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.209" (30.70mm)
Package Cooled: BGA
Attachment Method: Adhesive
Power Dissipation @ Temperature Rise: 6.1W @ 75°C
Thermal Resistance @ Forced Air Flow: 4.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.36°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 483 Stücke:
Lieferzeit 21-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 9+ | 3.07 EUR |
| 10+ | 2.92 EUR |
| 25+ | 2.84 EUR |
| 50+ | 2.77 EUR |
| 100+ | 2.61 EUR |
| 250+ | 2.46 EUR |
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Technische Details HSB13-303014 CUI Devices
Description: HEAT SINK, BGA, 30.7 X 30.7 X 14, Packaging: Box, Material: Aluminum Alloy, Length: 1.209" (30.70mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.209" (30.70mm), Package Cooled: BGA, Attachment Method: Adhesive, Power Dissipation @ Temperature Rise: 6.1W @ 75°C, Thermal Resistance @ Forced Air Flow: 4.70°C/W @ 200 LFM, Thermal Resistance @ Natural: 12.36°C/W, Fin Height: 0.551" (14.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB13-303014 nach Preis ab 2.44 EUR bis 3.28 EUR
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HSB13-303014 | Hersteller : CUI Devices |
Heat Sinks heat sink, BGA, 30.7 x 30.7 x 14.1 mm |
auf Bestellung 1422 Stücke: Lieferzeit 14-28 Tag (e) |
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