auf Bestellung 1422 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 2.22 EUR |
| 10+ | 2.09 EUR |
| 25+ | 2.06 EUR |
| 50+ | 2.01 EUR |
| 100+ | 1.88 EUR |
| 250+ | 1.78 EUR |
| 500+ | 1.65 EUR |
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Technische Details HSB13-303014 CUI Devices
Description: HEAT SINK, BGA, 30.7 X 30.7 X 14, Packaging: Box, Material: Aluminum Alloy, Length: 1.209" (30.70mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.209" (30.70mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 6.1W @ 75°C, Thermal Resistance @ Forced Air Flow: 4.70°C/W @ 200 LFM, Thermal Resistance @ Natural: 12.36°C/W, Fin Height: 0.551" (14.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB13-303014 nach Preis ab 1.72 EUR bis 2.31 EUR
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HSB13-303014 | Hersteller : Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 30.7 X 30.7 X 14Packaging: Box Material: Aluminum Alloy Length: 1.209" (30.70mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.209" (30.70mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 6.1W @ 75°C Thermal Resistance @ Forced Air Flow: 4.70°C/W @ 200 LFM Thermal Resistance @ Natural: 12.36°C/W Fin Height: 0.551" (14.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 260 Stücke: Lieferzeit 10-14 Tag (e) |
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| HSB13-303014 | Hersteller : Same Sky |
HSB13-303014 Heatsinks |
Produkt ist nicht verfügbar |