| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.64 EUR |
| 10+ | 2.49 EUR |
| 25+ | 2.45 EUR |
| 50+ | 2.39 EUR |
| 100+ | 2.24 EUR |
| 250+ | 2.12 EUR |
| 500+ | 1.96 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
Mindestmenge:
2 Stücke
Produktrezensionen
Produktbewertung abgeben
Technische Details HSB13-303014 CUI Devices
Description: HEAT SINK, BGA, 30.7 X 30.7 X 14, Packaging: Box, Material: Aluminum Alloy, Length: 1.209" (30.70mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.209" (30.70mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 6.1W @ 75°C, Thermal Resistance @ Forced Air Flow: 4.70°C/W @ 200 LFM, Thermal Resistance @ Natural: 12.36°C/W, Fin Height: 0.551" (14.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB13-303014 nach Preis ab 2.05 EUR bis 2.75 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
HSB13-303014 | Same Sky (Formerly CUI Devices) |
Description: HEAT SINK, BGA, 30.7 X 30.7 X 14Packaging: Box Material: Aluminum Alloy Length: 1.209" (30.70mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.209" (30.70mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 6.1W @ 75°C Thermal Resistance @ Forced Air Flow: 4.70°C/W @ 200 LFM Thermal Resistance @ Natural: 12.36°C/W Fin Height: 0.551" (14.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 260 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSB13-303014 |
![]() |
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 30.7 X 30.7 X 14
Packaging: Box
Material: Aluminum Alloy
Length: 1.209" (30.70mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.209" (30.70mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 6.1W @ 75°C
Thermal Resistance @ Forced Air Flow: 4.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.36°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK, BGA, 30.7 X 30.7 X 14
Packaging: Box
Material: Aluminum Alloy
Length: 1.209" (30.70mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.209" (30.70mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 6.1W @ 75°C
Thermal Resistance @ Forced Air Flow: 4.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.36°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 8+ | 2.75 EUR |
| 10+ | 2.43 EUR |
| 25+ | 2.32 EUR |
| 50+ | 2.24 EUR |
| 100+ | 2.15 EUR |
| 250+ | 2.05 EUR |



