auf Bestellung 1073 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 2.59 EUR |
| 10+ | 2.29 EUR |
| 25+ | 2.18 EUR |
| 50+ | 2.11 EUR |
| 100+ | 2.02 EUR |
| 250+ | 1.92 EUR |
| 500+ | 1.85 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details HSB14-353518 Same Sky
Description: HEAT SINK, BGA, 35 X 35 X 18 MM, Packaging: Box, Material: Aluminum Alloy, Length: 1.378" (35.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.378" (35.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 8.4W @ 75°C, Thermal Resistance @ Forced Air Flow: 3.60°C/W @ 200 LFM, Thermal Resistance @ Natural: 8.97°C/W, Fin Height: 0.709" (18.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB14-353518 nach Preis ab 1.87 EUR bis 2.69 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
HSB14-353518 | Hersteller : Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 35 X 35 X 18 MMPackaging: Box Material: Aluminum Alloy Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 8.4W @ 75°C Thermal Resistance @ Forced Air Flow: 3.60°C/W @ 200 LFM Thermal Resistance @ Natural: 8.97°C/W Fin Height: 0.709" (18.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 509 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
|
HSB14-353518 | Hersteller : CUI Devices |
Heat Sinks heat sink, BGA, 35 x 35 x 18 mm |
auf Bestellung 1592 Stücke: Lieferzeit 10-14 Tag (e) |
|