| Anzahl | Privatkunde |
|---|---|
| 1+ | 3.27 EUR |
| 10+ | 3 EUR |
| 25+ | 2.89 EUR |
| 50+ | 2.83 EUR |
| 70+ | 2.64 EUR |
| 280+ | 2.51 EUR |
| 560+ | 2.34 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
Produktrezensionen
Produktbewertung abgeben
Technische Details HSB15-404010 Same Sky
Description: HEAT SINK, BGA, 40 X 40 X 10 MM, Packaging: Box, Material: Aluminum Alloy, Length: 1.575" (40.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.575" (40.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 6.3W @ 75°C, Thermal Resistance @ Forced Air Flow: 3.90°C/W @ 200 LFM, Thermal Resistance @ Natural: 11.84°C/W, Fin Height: 0.394" (10.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB15-404010 nach Preis ab 2.67 EUR bis 3.86 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
HSB15-404010 | Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 40 X 40 X 10 MMPackaging: Box Material: Aluminum Alloy Length: 1.575" (40.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 6.3W @ 75°C Thermal Resistance @ Forced Air Flow: 3.90°C/W @ 200 LFM Thermal Resistance @ Natural: 11.84°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1716 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSB15-404010 |
|
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 40 X 40 X 10 MM
Packaging: Box
Material: Aluminum Alloy
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 6.3W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.90°C/W @ 200 LFM
Thermal Resistance @ Natural: 11.84°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK, BGA, 40 X 40 X 10 MM
Packaging: Box
Material: Aluminum Alloy
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 6.3W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.90°C/W @ 200 LFM
Thermal Resistance @ Natural: 11.84°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1716 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 3.86 EUR |
| 10+ | 3.4 EUR |
| 25+ | 3.25 EUR |
| 70+ | 3.07 EUR |
| 140+ | 2.96 EUR |
| 280+ | 2.86 EUR |
| 560+ | 2.75 EUR |
| 1050+ | 2.67 EUR |