| Anzahl | Preis |
|---|---|
| 2+ | 2.46 EUR |
| 10+ | 2.34 EUR |
| 25+ | 2.31 EUR |
| 50+ | 2.24 EUR |
| 100+ | 2.11 EUR |
| 250+ | 1.99 EUR |
| 500+ | 1.85 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details HSB15-404010 CUI Devices
Description: HEAT SINK, BGA, 40 X 40 X 10 MM, Packaging: Box, Material: Aluminum Alloy, Length: 1.575" (40.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.575" (40.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 6.3W @ 75°C, Thermal Resistance @ Forced Air Flow: 3.90°C/W @ 200 LFM, Thermal Resistance @ Natural: 11.84°C/W, Fin Height: 0.394" (10.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB15-404010 nach Preis ab 1.62 EUR bis 2.78 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
HSB15-404010 | Same Sky |
 Heat Sinks heat sink, BGA, 40 x 40 x 10 mm |
auf Bestellung 2475 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
HSB15-404010 | Same Sky (Formerly CUI Devices) |
Description: HEAT SINK, BGA, 40 X 40 X 10 MM Packaging: Box Material: Aluminum Alloy Length: 1.575" (40.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 6.3W @ 75°C Thermal Resistance @ Forced Air Flow: 3.90°C/W @ 200 LFM Thermal Resistance @ Natural: 11.84°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 192 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSB15-404010 |
|
Hersteller: Same Sky
Heat Sinks heat sink, BGA, 40 x 40 x 10 mm
Heat Sinks heat sink, BGA, 40 x 40 x 10 mm
auf Bestellung 2475 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 2.5 EUR |
| 10+ | 2.22 EUR |
| 25+ | 1.85 EUR |
| 70+ | 1.68 EUR |
| 280+ | 1.65 EUR |
| 560+ | 1.62 EUR |
| HSB15-404010 |
|
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 40 X 40 X 10 MM
Packaging: Box
Material: Aluminum Alloy
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 6.3W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.90°C/W @ 200 LFM
Thermal Resistance @ Natural: 11.84°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK, BGA, 40 X 40 X 10 MM
Packaging: Box
Material: Aluminum Alloy
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 6.3W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.90°C/W @ 200 LFM
Thermal Resistance @ Natural: 11.84°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 192 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 7+ | 2.78 EUR |
| 10+ | 2.47 EUR |
| 25+ | 2.35 EUR |
| 50+ | 2.27 EUR |
| 100+ | 2.19 EUR |