HSB16-404018 CUI Devices
Hersteller: CUI Devices
Description: HEAT SINK, BGA, 40 X 40 X 18 MM
Packaging: Box
Material: Aluminum Alloy
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Adhesive
Power Dissipation @ Temperature Rise: 9.4W @ 75°C
Thermal Resistance @ Forced Air Flow: 2.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.96°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK, BGA, 40 X 40 X 18 MM
Packaging: Box
Material: Aluminum Alloy
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Adhesive
Power Dissipation @ Temperature Rise: 9.4W @ 75°C
Thermal Resistance @ Forced Air Flow: 2.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.96°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1174 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
5+ | 3.59 EUR |
10+ | 3.49 EUR |
25+ | 3.4 EUR |
50+ | 3.21 EUR |
100+ | 3.02 EUR |
250+ | 2.83 EUR |
500+ | 2.74 EUR |
1000+ | 2.45 EUR |
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Technische Details HSB16-404018 CUI Devices
Description: HEAT SINK, BGA, 40 X 40 X 18 MM, Packaging: Box, Material: Aluminum Alloy, Length: 1.575" (40.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.575" (40.00mm), Package Cooled: BGA, Attachment Method: Adhesive, Power Dissipation @ Temperature Rise: 9.4W @ 75°C, Thermal Resistance @ Forced Air Flow: 2.60°C/W @ 200 LFM, Thermal Resistance @ Natural: 7.96°C/W, Fin Height: 0.709" (18.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB16-404018
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
HSB16-404018 | Hersteller : CUI Devices | Heat Sinks heat sink, BGA, 40 x 40 x 18 mm |
Produkt ist nicht verfügbar |