| Anzahl | Preis |
|---|---|
| 1+ | 4.08 EUR |
| 10+ | 3.63 EUR |
| 25+ | 3.45 EUR |
| 60+ | 3.27 EUR |
| 120+ | 3.08 EUR |
| 300+ | 2.99 EUR |
| 540+ | 2.85 EUR |
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Technische Details HSB17-404025 Same Sky
Description: HEAT SINK, BGA, 40 X 40 X 25 MM, Packaging: Box, Material: Aluminum Alloy, Length: 1.575" (40.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.575" (40.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 11.7W @ 75°C, Thermal Resistance @ Forced Air Flow: 2.10°C/W @ 200 LFM, Thermal Resistance @ Natural: 6.41°C/W, Fin Height: 0.984" (25.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB17-404025 nach Preis ab 3.12 EUR bis 4.38 EUR
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HSB17-404025 | Hersteller : CUI Devices |
 Heat Sinks heat sink, BGA, 40 x 40 x 25 mm |
auf Bestellung 746 Stücke: Lieferzeit 10-14 Tag (e) |
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HSB17-404025 | Hersteller : Same Sky (Formerly CUI Devices) |
Description: HEAT SINK, BGA, 40 X 40 X 25 MM Packaging: Box Material: Aluminum Alloy Length: 1.575" (40.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 11.7W @ 75°C Thermal Resistance @ Forced Air Flow: 2.10°C/W @ 200 LFM Thermal Resistance @ Natural: 6.41°C/W Fin Height: 0.984" (25.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 608 Stücke: Lieferzeit 10-14 Tag (e) |
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