| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.01 EUR |
| 10+ | 1.77 EUR |
| 25+ | 1.71 EUR |
| 50+ | 1.65 EUR |
| 100+ | 1.56 EUR |
| 300+ | 1.5 EUR |
| 600+ | 1.44 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
Mindestmenge:
2 Stücke
Produktrezensionen
Produktbewertung abgeben
Technische Details HSB18-232310 Same Sky
Description: HEAT SINK, BGA, 23 X 23 X 10 MM, Packaging: Box, Material: Aluminum Alloy, Length: 0.906" (23.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.906" (23.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 3.7W @ 75°C, Thermal Resistance @ Forced Air Flow: 6.80°C/W @ 200 LFM, Thermal Resistance @ Natural: 20.41°C/W, Fin Height: 0.394" (10.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB18-232310 nach Preis ab 1.59 EUR bis 2.07 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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HSB18-232310 | Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 23 X 23 X 10 MMPackaging: Box Material: Aluminum Alloy Length: 0.906" (23.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.906" (23.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 3.7W @ 75°C Thermal Resistance @ Forced Air Flow: 6.80°C/W @ 200 LFM Thermal Resistance @ Natural: 20.41°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 289 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSB18-232310 |
|
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 23 X 23 X 10 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.906" (23.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 3.7W @ 75°C
Thermal Resistance @ Forced Air Flow: 6.80°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.41°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK, BGA, 23 X 23 X 10 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.906" (23.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 3.7W @ 75°C
Thermal Resistance @ Forced Air Flow: 6.80°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.41°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 289 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 11+ | 2.07 EUR |
| 12+ | 1.83 EUR |
| 25+ | 1.75 EUR |
| 50+ | 1.69 EUR |
| 150+ | 1.59 EUR |