HSB18-232310 Same Sky (Formerly CUI Devices)
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 23 X 23 X 10 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.906" (23.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 3.7W @ 75°C
Thermal Resistance @ Forced Air Flow: 6.80°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.41°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
| Anzahl | Preis |
|---|---|
| 12+ | 1.58 EUR |
| 13+ | 1.4 EUR |
| 25+ | 1.34 EUR |
| 50+ | 1.29 EUR |
| 100+ | 1.24 EUR |
| 250+ | 1.18 EUR |
| 500+ | 1.14 EUR |
| 1872+ | 1.06 EUR |
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Technische Details HSB18-232310 Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 23 X 23 X 10 MM, Packaging: Box, Material: Aluminum Alloy, Length: 0.906" (23.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.906" (23.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 3.7W @ 75°C, Thermal Resistance @ Forced Air Flow: 6.80°C/W @ 200 LFM, Thermal Resistance @ Natural: 20.41°C/W, Fin Height: 0.394" (10.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB18-232310 nach Preis ab 1.06 EUR bis 1.61 EUR
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HSB18-232310 | Hersteller : Same Sky |
Heat Sinks heat sink, BGA, 23 x 23 x 10 mm |
auf Bestellung 1948 Stücke: Lieferzeit 10-14 Tag (e) |
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