| Anzahl | Privatkunde |
|---|---|
| 2+ | 2 EUR |
| 10+ | 1.77 EUR |
| 25+ | 1.5 EUR |
| 50+ | 1.46 EUR |
| 100+ | 1.36 EUR |
| 300+ | 1.31 EUR |
| 600+ | 1.29 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details HSB18-232310 Same Sky
Description: HEAT SINK, BGA, 23 X 23 X 10 MM, Part Status: Active, Material Finish: Black Anodized, Fin Height: 0.394" (10.00mm), Thermal Resistance @ Natural: 20.41°C/W, Thermal Resistance @ Forced Air Flow: 6.80°C/W @ 200 LFM, Power Dissipation @ Temperature Rise: 3.7W @ 75°C, Attachment Method: Adhesive (Not Included), Package Cooled: BGA, Width: 0.906" (23.00mm), Type: Top Mount, Shape: Square, Pin Fins, Length: 0.906" (23.00mm), Material: Aluminum Alloy, Packaging: Box.
Weitere Produktangebote HSB18-232310 nach Preis ab 1.5 EUR bis 2.03 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
HSB18-232310 | Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 23 X 23 X 10 MMPart Status: Active Material Finish: Black Anodized Fin Height: 0.394" (10.00mm) Thermal Resistance @ Natural: 20.41°C/W Thermal Resistance @ Forced Air Flow: 6.80°C/W @ 200 LFM Power Dissipation @ Temperature Rise: 3.7W @ 75°C Attachment Method: Adhesive (Not Included) Package Cooled: BGA Width: 0.906" (23.00mm) Type: Top Mount Shape: Square, Pin Fins Length: 0.906" (23.00mm) Material: Aluminum Alloy Packaging: Box |
auf Bestellung 334 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSB18-232310 |
|
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 23 X 23 X 10 MM
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Natural: 20.41°C/W
Thermal Resistance @ Forced Air Flow: 6.80°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 3.7W @ 75°C
Attachment Method: Adhesive (Not Included)
Package Cooled: BGA
Width: 0.906" (23.00mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 0.906" (23.00mm)
Material: Aluminum Alloy
Packaging: Box
Description: HEAT SINK, BGA, 23 X 23 X 10 MM
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Natural: 20.41°C/W
Thermal Resistance @ Forced Air Flow: 6.80°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 3.7W @ 75°C
Attachment Method: Adhesive (Not Included)
Package Cooled: BGA
Width: 0.906" (23.00mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 0.906" (23.00mm)
Material: Aluminum Alloy
Packaging: Box
auf Bestellung 334 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 11+ | 2.03 EUR |
| 12+ | 1.78 EUR |
| 25+ | 1.7 EUR |
| 50+ | 1.64 EUR |
| 150+ | 1.55 EUR |
| 300+ | 1.5 EUR |