auf Bestellung 350 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 2.99 EUR |
| 10+ | 2.66 EUR |
| 25+ | 2.53 EUR |
| 50+ | 2.45 EUR |
| 100+ | 2.36 EUR |
| 250+ | 2.29 EUR |
| 500+ | 2.11 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details HSB19-272718 Same Sky
Description: HEAT SINK, BGA, 27 X 27 X 18 MM, Packaging: Box, Material: Aluminum Alloy, Length: 1.063" (27.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.063" (27.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 6.8W @ 75°C, Thermal Resistance @ Forced Air Flow: 4.50°C/W @ 200 LFM, Thermal Resistance @ Natural: 11.11°C/W, Fin Height: 0.709" (18.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB19-272718 nach Preis ab 2.36 EUR bis 3.33 EUR
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HSB19-272718 | Hersteller : CUI Devices |
 Heat Sinks heat sink, BGA, 27 x 27 x 18 mm |
auf Bestellung 1680 Stücke: Lieferzeit 136-140 Tag (e) |
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HSB19-272718 | Hersteller : Same Sky (Formerly CUI Devices) |
Description: HEAT SINK, BGA, 27 X 27 X 18 MM Packaging: Box Material: Aluminum Alloy Length: 1.063" (27.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.063" (27.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 6.8W @ 75°C Thermal Resistance @ Forced Air Flow: 4.50°C/W @ 200 LFM Thermal Resistance @ Natural: 11.11°C/W Fin Height: 0.709" (18.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 441 Stücke: Lieferzeit 10-14 Tag (e) |
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| HSB19-272718 | Hersteller : CUI DEVICES |
27 x 27 mm, BGA Heat Sink, Aluminum, PCB |
Produkt ist nicht verfügbar |