| Anzahl | Privatkunde |
|---|---|
| 1+ | 3.75 EUR |
| 10+ | 3.39 EUR |
| 25+ | 2.87 EUR |
| 50+ | 2.68 EUR |
| 117+ | 2.59 EUR |
| 234+ | 2.48 EUR |
| 585+ | 2.39 EUR |
Produktrezensionen
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Technische Details HSB19-272718 Same Sky
Description: HEAT SINK, BGA, 27 X 27 X 18 MM, Packaging: Box, Material: Aluminum Alloy, Length: 1.063" (27.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.063" (27.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 6.8W @ 75°C, Thermal Resistance @ Forced Air Flow: 4.50°C/W @ 200 LFM, Thermal Resistance @ Natural: 11.11°C/W, Fin Height: 0.709" (18.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB19-272718 nach Preis ab 2.61 EUR bis 3.77 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
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HSB19-272718 | CUI Devices |
 Heat Sinks heat sink, BGA, 27 x 27 x 18 mm |
auf Bestellung 1680 Stücke: Lieferzeit 136-140 Tag (e) |
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HSB19-272718 | Same Sky (Formerly CUI Devices) |
Description: HEAT SINK, BGA, 27 X 27 X 18 MM Packaging: Box Material: Aluminum Alloy Length: 1.063" (27.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.063" (27.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 6.8W @ 75°C Thermal Resistance @ Forced Air Flow: 4.50°C/W @ 200 LFM Thermal Resistance @ Natural: 11.11°C/W Fin Height: 0.709" (18.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1070 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSB19-272718 |
|
Hersteller: CUI Devices
Heat Sinks heat sink, BGA, 27 x 27 x 18 mm
Heat Sinks heat sink, BGA, 27 x 27 x 18 mm
auf Bestellung 1680 Stücke:
Lieferzeit 136-140 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 3.75 EUR |
| 10+ | 3.53 EUR |
| 25+ | 3.47 EUR |
| 50+ | 3.37 EUR |
| 100+ | 3.19 EUR |
| 250+ | 3 EUR |
| 500+ | 2.81 EUR |
| HSB19-272718 |
|
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 27 X 27 X 18 MM
Packaging: Box
Material: Aluminum Alloy
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 6.8W @ 75°C
Thermal Resistance @ Forced Air Flow: 4.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 11.11°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK, BGA, 27 X 27 X 18 MM
Packaging: Box
Material: Aluminum Alloy
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 6.8W @ 75°C
Thermal Resistance @ Forced Air Flow: 4.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 11.11°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1070 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 3.77 EUR |
| 10+ | 3.33 EUR |
| 25+ | 3.18 EUR |
| 50+ | 3.06 EUR |
| 117+ | 2.93 EUR |
| 351+ | 2.76 EUR |
| 585+ | 2.69 EUR |
| 1053+ | 2.61 EUR |