HSB20-353525 CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, BGA, 35 X 35 X 25 MM
Packaging: Box
Material: Aluminum Alloy
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Adhesive
Power Dissipation @ Temperature Rise: 11.3W @ 75°C
Thermal Resistance @ Forced Air Flow: 2.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 6.65°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1671 Stücke:
Lieferzeit 21-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 4.76 EUR |
| 10+ | 4.63 EUR |
| 25+ | 4.5 EUR |
| 50+ | 4.25 EUR |
| 100+ | 4 EUR |
| 250+ | 3.75 EUR |
| 500+ | 3.63 EUR |
| 1000+ | 3.25 EUR |
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Technische Details HSB20-353525 CUI Devices
Description: HEAT SINK, BGA, 35 X 35 X 25 MM, Packaging: Box, Material: Aluminum Alloy, Length: 1.378" (35.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.378" (35.00mm), Package Cooled: BGA, Attachment Method: Adhesive, Power Dissipation @ Temperature Rise: 11.3W @ 75°C, Thermal Resistance @ Forced Air Flow: 2.70°C/W @ 200 LFM, Thermal Resistance @ Natural: 6.65°C/W, Fin Height: 0.984" (25.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB20-353525 nach Preis ab 3.74 EUR bis 4.76 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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HSB20-353525 | Hersteller : CUI Devices |
Heat Sinks heat sink, BGA, 35 x 35 x 25 mm |
auf Bestellung 1367 Stücke: Lieferzeit 14-28 Tag (e) |
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