auf Bestellung 1207 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 3.13 EUR |
| 10+ | 2.87 EUR |
| 25+ | 2.75 EUR |
| 50+ | 2.64 EUR |
| 100+ | 2.53 EUR |
| 250+ | 2.43 EUR |
| 500+ | 2.32 EUR |
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Produktbewertung abgeben
Technische Details HSB20-353525 Same Sky
Description: HEAT SINK, BGA, 35 X 35 X 25 MM, Packaging: Box, Material: Aluminum Alloy, Length: 1.378" (35.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.378" (35.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 11.3W @ 75°C, Thermal Resistance @ Forced Air Flow: 2.70°C/W @ 200 LFM, Thermal Resistance @ Natural: 6.65°C/W, Fin Height: 0.984" (25.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB20-353525 nach Preis ab 2.58 EUR bis 3.59 EUR
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HSB20-353525 | Hersteller : Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 35 X 35 X 25 MMPackaging: Box Material: Aluminum Alloy Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 11.3W @ 75°C Thermal Resistance @ Forced Air Flow: 2.70°C/W @ 200 LFM Thermal Resistance @ Natural: 6.65°C/W Fin Height: 0.984" (25.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1143 Stücke: Lieferzeit 10-14 Tag (e) |
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| HSB20-353525 | Hersteller : CUI DEVICES |
35 x 35 mm, BGA Heat Sink, Aluminum, PCB |
Produkt ist nicht verfügbar |
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| HSB20-353525 | Hersteller : Same Sky |
Category: Heatsinks Description: Heatsink: extruded; grilled; black; L: 35mm; W: 35mm; H: 25mm Type of heatsink: extruded Mounting: for back plate Heatsink shape: grilled Base thickness: 2.1mm Length: 35mm Height: 25mm Width: 35mm Thermal resistance @200 LFM: 2.7°C/W Thermal resistance: max. 9.9°C/W Material: aluminium Material finishing: anodized Colour: black |
Produkt ist nicht verfügbar |