HSB21-454515 CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, BGA, 45 X 45 X 15 MM
Packaging: Box
Material: Aluminum Alloy
Length: 1.772" (45.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: BGA
Attachment Method: Adhesive
Power Dissipation @ Temperature Rise: 9.9W @ 75°C
Thermal Resistance @ Forced Air Flow: 2.80°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.56°C/W
Fin Height: 0.591" (15.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1008 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 3.47 EUR |
| 10+ | 3.37 EUR |
| 25+ | 3.28 EUR |
| 50+ | 3.1 EUR |
| 100+ | 2.92 EUR |
| 250+ | 2.73 EUR |
| 500+ | 2.64 EUR |
| 1000+ | 2.37 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details HSB21-454515 CUI Devices
Description: HEAT SINK, BGA, 45 X 45 X 15 MM, Packaging: Box, Material: Aluminum Alloy, Length: 1.772" (45.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.772" (45.00mm), Package Cooled: BGA, Attachment Method: Adhesive, Power Dissipation @ Temperature Rise: 9.9W @ 75°C, Thermal Resistance @ Forced Air Flow: 2.80°C/W @ 200 LFM, Thermal Resistance @ Natural: 7.56°C/W, Fin Height: 0.591" (15.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB21-454515 nach Preis ab 3.93 EUR bis 5.02 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
HSB21-454515 | Hersteller : CUI Devices |
Heat Sinks heat sink, BGA, 45 x 45 x 15 mm |
auf Bestellung 1188 Stücke: Lieferzeit 14-28 Tag (e) |
|