auf Bestellung 683 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 3.43 EUR |
| 10+ | 3.06 EUR |
| 25+ | 2.9 EUR |
| 50+ | 2.82 EUR |
| 100+ | 2.62 EUR |
| 260+ | 2.52 EUR |
| 520+ | 2.43 EUR |
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Technische Details HSB21-454515 Same Sky
Description: HEAT SINK, BGA, 45 X 45 X 15 MM, Packaging: Box, Material: Aluminum Alloy, Length: 1.772" (45.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.772" (45.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 9.9W @ 75°C, Thermal Resistance @ Forced Air Flow: 2.80°C/W @ 200 LFM, Thermal Resistance @ Natural: 7.56°C/W, Fin Height: 0.591" (15.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB21-454515 nach Preis ab 2.66 EUR bis 3.5 EUR
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HSB21-454515 | Hersteller : CUI Devices |
 Heat Sinks heat sink, BGA, 45 x 45 x 15 mm |
auf Bestellung 941 Stücke: Lieferzeit 10-14 Tag (e) |
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HSB21-454515 | Hersteller : CUI Devices |
Description: HEAT SINK, BGA, 45 X 45 X 15 MM Packaging: Box Material: Aluminum Alloy Length: 1.772" (45.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.772" (45.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 9.9W @ 75°C Thermal Resistance @ Forced Air Flow: 2.80°C/W @ 200 LFM Thermal Resistance @ Natural: 7.56°C/W Fin Height: 0.591" (15.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 875 Stücke: Lieferzeit 10-14 Tag (e) |
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