| Anzahl | Preis |
|---|---|
| 1+ | 4.95 EUR |
| 10+ | 4.59 EUR |
| 25+ | 4.47 EUR |
| 50+ | 4.22 EUR |
| 100+ | 3.96 EUR |
| 250+ | 3.73 EUR |
| 500+ | 3.63 EUR |
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Technische Details HSB22-606010 Same Sky
Description: HEAT SINK, BGA, 60 X 60 X 10 MM, Material Finish: Black Anodized, Fin Height: 0.394" (10.00mm), Thermal Resistance @ Natural: 7.62°C/W, Thermal Resistance @ Forced Air Flow: 2.60°C/W @ 200 LFM, Power Dissipation @ Temperature Rise: 9.8W @ 75°C, Attachment Method: Adhesive (Not Included), Package Cooled: BGA, Width: 2.362" (60.00mm), Type: Top Mount, Shape: Square, Pin Fins, Length: 2.362" (60.00mm), Material: Aluminum, Packaging: Box.
Weitere Produktangebote HSB22-606010
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
|---|---|---|---|---|---|
 |
HSB22-606010 | Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 60 X 60 X 10 MMMaterial Finish: Black Anodized Fin Height: 0.394" (10.00mm) Thermal Resistance @ Natural: 7.62°C/W Thermal Resistance @ Forced Air Flow: 2.60°C/W @ 200 LFM Power Dissipation @ Temperature Rise: 9.8W @ 75°C Attachment Method: Adhesive (Not Included) Package Cooled: BGA Width: 2.362" (60.00mm) Type: Top Mount Shape: Square, Pin Fins Length: 2.362" (60.00mm) Material: Aluminum Packaging: Box |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH |
| HSB22-606010 |
|
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 60 X 60 X 10 MM
Material Finish: Black Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Natural: 7.62°C/W
Thermal Resistance @ Forced Air Flow: 2.60°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 9.8W @ 75°C
Attachment Method: Adhesive (Not Included)
Package Cooled: BGA
Width: 2.362" (60.00mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 2.362" (60.00mm)
Material: Aluminum
Packaging: Box
Description: HEAT SINK, BGA, 60 X 60 X 10 MM
Material Finish: Black Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Natural: 7.62°C/W
Thermal Resistance @ Forced Air Flow: 2.60°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 9.8W @ 75°C
Attachment Method: Adhesive (Not Included)
Package Cooled: BGA
Width: 2.362" (60.00mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 2.362" (60.00mm)
Material: Aluminum
Packaging: Box
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH