auf Bestellung 668 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 4.95 EUR |
| 10+ | 4.59 EUR |
| 25+ | 4.47 EUR |
| 50+ | 4.22 EUR |
| 100+ | 3.96 EUR |
| 250+ | 3.73 EUR |
| 500+ | 3.63 EUR |
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Technische Details HSB22-606010 Same Sky
Description: HEAT SINK, BGA, 60 X 60 X 10 MM, Packaging: Box, Material: Aluminum, Length: 2.362" (60.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 2.362" (60.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 9.8W @ 75°C, Thermal Resistance @ Forced Air Flow: 2.60°C/W @ 200 LFM, Thermal Resistance @ Natural: 7.62°C/W, Fin Height: 0.394" (10.00mm), Material Finish: Black Anodized.
Weitere Produktangebote HSB22-606010
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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HSB22-606010 | Hersteller : Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 60 X 60 X 10 MMPackaging: Box Material: Aluminum Length: 2.362" (60.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 2.362" (60.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 9.8W @ 75°C Thermal Resistance @ Forced Air Flow: 2.60°C/W @ 200 LFM Thermal Resistance @ Natural: 7.62°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |