| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.67 EUR |
| 10+ | 2.59 EUR |
| 25+ | 2.51 EUR |
| 50+ | 2.37 EUR |
| 100+ | 2.12 EUR |
| 250+ | 2.09 EUR |
| 500+ | 1.96 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details HSB23-232325 CUI Devices
Description: HEAT SINK, BGA, 23 X 23 X 25 MM, Part Status: Active, Material Finish: Black Anodized, Fin Height: 0.984" (25.00mm), Thermal Resistance @ Natural: 12.23°C/W, Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM, Power Dissipation @ Temperature Rise: 6.13W @ 75°C, Attachment Method: Adhesive (Not Included), Package Cooled: BGA, Width: 0.906" (23.00mm), Type: Top Mount, Shape: Square, Pin Fins, Length: 0.906" (23.00mm), Material: Aluminum Alloy, Packaging: Box.
Weitere Produktangebote HSB23-232325 nach Preis ab 1.7 EUR bis 3.06 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
HSB23-232325 | Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 23 X 23 X 25 MMPart Status: Active Material Finish: Black Anodized Fin Height: 0.984" (25.00mm) Thermal Resistance @ Natural: 12.23°C/W Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM Power Dissipation @ Temperature Rise: 6.13W @ 75°C Attachment Method: Adhesive (Not Included) Package Cooled: BGA Width: 0.906" (23.00mm) Type: Top Mount Shape: Square, Pin Fins Length: 0.906" (23.00mm) Material: Aluminum Alloy Packaging: Box |
auf Bestellung 999 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
|
|
HSB23-232325 | Same Sky |
Heat Sinks heat sink, BGA, 23 x 23 x 25 mm |
auf Bestellung 1470 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSB23-232325 |
|
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 23 X 23 X 25 MM
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.984" (25.00mm)
Thermal Resistance @ Natural: 12.23°C/W
Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 6.13W @ 75°C
Attachment Method: Adhesive (Not Included)
Package Cooled: BGA
Width: 0.906" (23.00mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 0.906" (23.00mm)
Material: Aluminum Alloy
Packaging: Box
Description: HEAT SINK, BGA, 23 X 23 X 25 MM
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.984" (25.00mm)
Thermal Resistance @ Natural: 12.23°C/W
Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 6.13W @ 75°C
Attachment Method: Adhesive (Not Included)
Package Cooled: BGA
Width: 0.906" (23.00mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 0.906" (23.00mm)
Material: Aluminum Alloy
Packaging: Box
auf Bestellung 999 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 8+ | 2.78 EUR |
| 10+ | 2.34 EUR |
| 25+ | 2.17 EUR |
| 50+ | 2.03 EUR |
| 100+ | 1.9 EUR |
| 250+ | 1.74 EUR |
| 704+ | 1.7 EUR |
| HSB23-232325 |
|
Hersteller: Same Sky
Heat Sinks heat sink, BGA, 23 x 23 x 25 mm
Heat Sinks heat sink, BGA, 23 x 23 x 25 mm
auf Bestellung 1470 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 3.06 EUR |
| 10+ | 2.75 EUR |
| 25+ | 2.4 EUR |
| 50+ | 2.39 EUR |
| 100+ | 2.07 EUR |
| 280+ | 1.96 EUR |
| 560+ | 1.93 EUR |