auf Bestellung 1536 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 2.24 EUR |
| 10+ | 2.18 EUR |
| 25+ | 2.11 EUR |
| 50+ | 1.99 EUR |
| 100+ | 1.78 EUR |
| 250+ | 1.76 EUR |
| 500+ | 1.65 EUR |
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Technische Details HSB23-232325 CUI Devices
Description: HEAT SINK, BGA, 23 X 23 X 25 MM, Packaging: Box, Material: Aluminum Alloy, Length: 0.906" (23.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.906" (23.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 6.13W @ 75°C, Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM, Thermal Resistance @ Natural: 12.23°C/W, Fin Height: 0.984" (25.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB23-232325 nach Preis ab 1.43 EUR bis 2.34 EUR
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HSB23-232325 | Hersteller : Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 23 X 23 X 25 MMPackaging: Box Material: Aluminum Alloy Length: 0.906" (23.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.906" (23.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 6.13W @ 75°C Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM Thermal Resistance @ Natural: 12.23°C/W Fin Height: 0.984" (25.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 999 Stücke: Lieferzeit 10-14 Tag (e) |
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| HSB23-232325 | Hersteller : CUI DEVICES |
23 x 23 mm, BGA Heat Sink, Aluminum, PCB |
Produkt ist nicht verfügbar |
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| HSB23-232325 | Hersteller : Same Sky |
Category: Heatsinks Description: Heatsink: extruded; grilled; black; L: 23mm; W: 23mm; H: 25mm Type of heatsink: extruded Mounting: for back plate Heatsink shape: grilled Base thickness: 2.1mm Length: 23mm Width: 23mm Height: 25mm Thermal resistance @200 LFM: 3.8°C/W Thermal resistance: max. 16.1°C/W Material: aluminium Material finishing: anodized Colour: black |
Produkt ist nicht verfügbar |