| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.67 EUR |
| 10+ | 2.59 EUR |
| 25+ | 2.51 EUR |
| 50+ | 2.37 EUR |
| 100+ | 2.12 EUR |
| 250+ | 2.09 EUR |
| 500+ | 1.96 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
Mindestmenge:
2 Stücke
Produktrezensionen
Produktbewertung abgeben
Technische Details HSB23-232325 CUI Devices
Description: HEAT SINK, BGA, 23 X 23 X 25 MM, Packaging: Box, Material: Aluminum Alloy, Length: 0.906" (23.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.906" (23.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 6.13W @ 75°C, Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM, Thermal Resistance @ Natural: 12.23°C/W, Fin Height: 0.984" (25.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB23-232325 nach Preis ab 1.7 EUR bis 3.03 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
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HSB23-232325 | Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 23 X 23 X 25 MMPackaging: Box Material: Aluminum Alloy Length: 0.906" (23.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.906" (23.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 6.13W @ 75°C Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM Thermal Resistance @ Natural: 12.23°C/W Fin Height: 0.984" (25.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 999 Stücke: Lieferzeit 10-14 Tag (e) |
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HSB23-232325 | Same Sky |
Heat Sinks heat sink, BGA, 23 x 23 x 25 mm |
auf Bestellung 1354 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSB23-232325 |
|
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 23 X 23 X 25 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.906" (23.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 6.13W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.23°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK, BGA, 23 X 23 X 25 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.906" (23.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 6.13W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.23°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 999 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 8+ | 2.78 EUR |
| 10+ | 2.34 EUR |
| 25+ | 2.17 EUR |
| 50+ | 2.03 EUR |
| 100+ | 1.9 EUR |
| 250+ | 1.74 EUR |
| 704+ | 1.7 EUR |
| HSB23-232325 |
|
Hersteller: Same Sky
Heat Sinks heat sink, BGA, 23 x 23 x 25 mm
Heat Sinks heat sink, BGA, 23 x 23 x 25 mm
auf Bestellung 1354 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 3.03 EUR |
| 10+ | 2.75 EUR |
| 25+ | 2.62 EUR |
| 50+ | 2.51 EUR |
| 100+ | 2.39 EUR |
| 280+ | 2.24 EUR |
| 560+ | 2.12 EUR |