| Anzahl | Privatkunde |
|---|---|
| 3+ | 1.58 EUR |
| 10+ | 1.54 EUR |
| 25+ | 1.49 EUR |
| 50+ | 1.4 EUR |
| 100+ | 1.26 EUR |
| 250+ | 1.24 EUR |
| 500+ | 1.15 EUR |
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Technische Details HSB24-252510 CUI Devices
Description: HEAT SINK, BGA,25 X 25 X 10 MM, Part Status: Active, Material Finish: Black Anodized, Fin Height: 0.394" (10.00mm), Thermal Resistance @ Natural: 18.10°C/W, Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM, Power Dissipation @ Temperature Rise: 4.14W @ 75°C, Attachment Method: Adhesive (Not Included), Package Cooled: BGA, Width: 0.984" (25.00mm), Type: Top Mount, Shape: Square, Pin Fins, Length: 0.984" (25.00mm), Material: Aluminum Alloy, Packaging: Box.
Weitere Produktangebote HSB24-252510 nach Preis ab 1.08 EUR bis 1.82 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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HSB24-252510 | Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA,25 X 25 X 10 MMPart Status: Active Material Finish: Black Anodized Fin Height: 0.394" (10.00mm) Thermal Resistance @ Natural: 18.10°C/W Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM Power Dissipation @ Temperature Rise: 4.14W @ 75°C Attachment Method: Adhesive (Not Included) Package Cooled: BGA Width: 0.984" (25.00mm) Type: Top Mount Shape: Square, Pin Fins Length: 0.984" (25.00mm) Material: Aluminum Alloy Packaging: Box |
auf Bestellung 1570 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSB24-252510 |
|
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA,25 X 25 X 10 MM
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Natural: 18.10°C/W
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 4.14W @ 75°C
Attachment Method: Adhesive (Not Included)
Package Cooled: BGA
Width: 0.984" (25.00mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 0.984" (25.00mm)
Material: Aluminum Alloy
Packaging: Box
Description: HEAT SINK, BGA,25 X 25 X 10 MM
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Natural: 18.10°C/W
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 4.14W @ 75°C
Attachment Method: Adhesive (Not Included)
Package Cooled: BGA
Width: 0.984" (25.00mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 0.984" (25.00mm)
Material: Aluminum Alloy
Packaging: Box
auf Bestellung 1570 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 12+ | 1.82 EUR |
| 14+ | 1.54 EUR |
| 25+ | 1.43 EUR |
| 50+ | 1.34 EUR |
| 100+ | 1.26 EUR |
| 250+ | 1.15 EUR |
| 720+ | 1.08 EUR |