| Anzahl | Privatkunde |
|---|---|
| 2+ | 1.58 EUR |
| 10+ | 1.54 EUR |
| 25+ | 1.49 EUR |
| 50+ | 1.4 EUR |
| 100+ | 1.26 EUR |
| 250+ | 1.24 EUR |
| 500+ | 1.15 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
Mindestmenge:
2 Stücke
Produktrezensionen
Produktbewertung abgeben
Technische Details HSB24-252510 CUI Devices
Description: HEAT SINK, BGA,25 X 25 X 10 MM, Packaging: Box, Material: Aluminum Alloy, Length: 0.984" (25.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.984" (25.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 4.14W @ 75°C, Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM, Thermal Resistance @ Natural: 18.10°C/W, Fin Height: 0.394" (10.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB24-252510 nach Preis ab 1.08 EUR bis 1.82 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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HSB24-252510 | Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA,25 X 25 X 10 MMPackaging: Box Material: Aluminum Alloy Length: 0.984" (25.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.984" (25.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 4.14W @ 75°C Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM Thermal Resistance @ Natural: 18.10°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1570 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSB24-252510 |
|
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA,25 X 25 X 10 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.984" (25.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.984" (25.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 4.14W @ 75°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.10°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK, BGA,25 X 25 X 10 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.984" (25.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.984" (25.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 4.14W @ 75°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.10°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1570 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 12+ | 1.82 EUR |
| 14+ | 1.54 EUR |
| 25+ | 1.43 EUR |
| 50+ | 1.34 EUR |
| 100+ | 1.26 EUR |
| 250+ | 1.15 EUR |
| 720+ | 1.08 EUR |