HSB25-282810 CUI Devices
| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.53 EUR |
| 10+ | 2.43 EUR |
| 25+ | 2.37 EUR |
| 50+ | 2.23 EUR |
| 100+ | 2.01 EUR |
| 250+ | 1.96 EUR |
| 500+ | 1.86 EUR |
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Technische Details HSB25-282810 CUI Devices
Description: HEAT SINK, BGA, 28.5 X 28.5 X 10, Packaging: Box, Material: Aluminum Alloy, Length: 1.122" (28.50mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.122" (28.50mm), Package Cooled: BGA, Attachment Method: Push Pin, Power Dissipation @ Temperature Rise: 4.87W @ 75°C, Thermal Resistance @ Forced Air Flow: 5.10°C/W @ 200 LFM, Thermal Resistance @ Natural: 15.41°C/W, Fin Height: 0.394" (10.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB25-282810 nach Preis ab 1.69 EUR bis 2.92 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
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HSB25-282810 | Same Sky |
 Heat Sinks heat sink, BGA, 28.5 x 28.5 x 10 mm, mounting holes |
auf Bestellung 1461 Stücke: Lieferzeit 10-14 Tag (e) |
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HSB25-282810 | Same Sky (Formerly CUI Devices) |
Description: HEAT SINK, BGA, 28.5 X 28.5 X 10 Packaging: Box Material: Aluminum Alloy Length: 1.122" (28.50mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.122" (28.50mm) Package Cooled: BGA Attachment Method: Push Pin Power Dissipation @ Temperature Rise: 4.87W @ 75°C Thermal Resistance @ Forced Air Flow: 5.10°C/W @ 200 LFM Thermal Resistance @ Natural: 15.41°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 427 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSB25-282810 |
|
Hersteller: Same Sky
Heat Sinks heat sink, BGA, 28.5 x 28.5 x 10 mm, mounting holes
Heat Sinks heat sink, BGA, 28.5 x 28.5 x 10 mm, mounting holes
auf Bestellung 1461 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.67 EUR |
| 10+ | 2.24 EUR |
| 25+ | 2.07 EUR |
| 50+ | 1.95 EUR |
| 100+ | 1.82 EUR |
| 250+ | 1.69 EUR |
| HSB25-282810 |
|
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 28.5 X 28.5 X 10
Packaging: Box
Material: Aluminum Alloy
Length: 1.122" (28.50mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.122" (28.50mm)
Package Cooled: BGA
Attachment Method: Push Pin
Power Dissipation @ Temperature Rise: 4.87W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.41°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK, BGA, 28.5 X 28.5 X 10
Packaging: Box
Material: Aluminum Alloy
Length: 1.122" (28.50mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.122" (28.50mm)
Package Cooled: BGA
Attachment Method: Push Pin
Power Dissipation @ Temperature Rise: 4.87W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.41°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 427 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 8+ | 2.92 EUR |
| 10+ | 2.58 EUR |
| 35+ | 2.42 EUR |
| 70+ | 2.33 EUR |
| 105+ | 2.27 EUR |
| 280+ | 2.17 EUR |