HSB25-282810 CUI Devices
Hersteller: CUI Devices
Description: HEAT SINK, BGA, 28.5 X 28.5 X 10
Packaging: Box
Material: Aluminum Alloy
Length: 1.122" (28.50mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.122" (28.50mm)
Package Cooled: BGA
Attachment Method: Push Pin
Power Dissipation @ Temperature Rise: 4.87W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.41°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK, BGA, 28.5 X 28.5 X 10
Packaging: Box
Material: Aluminum Alloy
Length: 1.122" (28.50mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.122" (28.50mm)
Package Cooled: BGA
Attachment Method: Push Pin
Power Dissipation @ Temperature Rise: 4.87W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.41°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1077 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
9+ | 3.09 EUR |
10+ | 2.99 EUR |
25+ | 2.9 EUR |
50+ | 2.73 EUR |
100+ | 2.45 EUR |
250+ | 2.42 EUR |
500+ | 2.26 EUR |
1000+ | 2.23 EUR |
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Technische Details HSB25-282810 CUI Devices
Description: HEAT SINK, BGA, 28.5 X 28.5 X 10, Packaging: Box, Material: Aluminum Alloy, Length: 1.122" (28.50mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.122" (28.50mm), Package Cooled: BGA, Attachment Method: Push Pin, Power Dissipation @ Temperature Rise: 4.87W @ 75°C, Thermal Resistance @ Forced Air Flow: 5.10°C/W @ 200 LFM, Thermal Resistance @ Natural: 15.41°C/W, Fin Height: 0.394" (10.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB25-282810 nach Preis ab 2.3 EUR bis 3.15 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||||||||
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HSB25-282810 | Hersteller : CUI Devices | Heat Sinks heat sink, BGA, 28.5 x 28.5 x 10 mm, mounting holes |
auf Bestellung 643 Stücke: Lieferzeit 14-28 Tag (e) |
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