HSB25-282810 CUI Devices
auf Bestellung 643 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 2.13 EUR |
| 10+ | 2.04 EUR |
| 25+ | 1.99 EUR |
| 50+ | 1.87 EUR |
| 100+ | 1.69 EUR |
| 250+ | 1.65 EUR |
| 500+ | 1.56 EUR |
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Technische Details HSB25-282810 CUI Devices
Description: HEAT SINK, BGA, 28.5 X 28.5 X 10, Packaging: Box, Material: Aluminum Alloy, Length: 1.122" (28.50mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.122" (28.50mm), Package Cooled: BGA, Attachment Method: Push Pin, Power Dissipation @ Temperature Rise: 4.87W @ 75°C, Thermal Resistance @ Forced Air Flow: 5.10°C/W @ 200 LFM, Thermal Resistance @ Natural: 15.41°C/W, Fin Height: 0.394" (10.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB25-282810 nach Preis ab 1.39 EUR bis 2.29 EUR
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HSB25-282810 | Hersteller : Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 28.5 X 28.5 X 10Packaging: Box Material: Aluminum Alloy Length: 1.122" (28.50mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.122" (28.50mm) Package Cooled: BGA Attachment Method: Push Pin Power Dissipation @ Temperature Rise: 4.87W @ 75°C Thermal Resistance @ Forced Air Flow: 5.10°C/W @ 200 LFM Thermal Resistance @ Natural: 15.41°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1422 Stücke: Lieferzeit 10-14 Tag (e) |
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