HSB26-343408 CUI Devices
Hersteller: CUI Devices
Description: HEAT SINK, BGA, 33.5 X 33.5 X 8
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.315" (8.00mm)
Thermal Resistance @ Natural: 15.19°C/W
Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 4.94W @ 75°C
Attachment Method: Adhesive (Not Included)
Package Cooled: BGA
Width: 1.319" (33.50mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 1.319" (33.50mm)
Material: Aluminum Alloy
Packaging: Box
| Anzahl | Privatkunde |
|---|---|
| 10+ | 2.15 EUR |
| 25+ | 2.08 EUR |
| 50+ | 1.96 EUR |
| 100+ | 1.76 EUR |
| 250+ | 1.74 EUR |
| 640+ | 1.63 EUR |
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Technische Details HSB26-343408 CUI Devices
Description: HEAT SINK, BGA, 33.5 X 33.5 X 8, Part Status: Active, Material Finish: Black Anodized, Fin Height: 0.315" (8.00mm), Thermal Resistance @ Natural: 15.19°C/W, Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM, Power Dissipation @ Temperature Rise: 4.94W @ 75°C, Attachment Method: Adhesive (Not Included), Package Cooled: BGA, Width: 1.319" (33.50mm), Type: Top Mount, Shape: Square, Pin Fins, Length: 1.319" (33.50mm), Material: Aluminum Alloy, Packaging: Box.
Weitere Produktangebote HSB26-343408 nach Preis ab 1.77 EUR bis 2.51 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
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HSB26-343408 | Same Sky |
Heat Sinks heat sink, BGA, 33.5 x 33.5 x 8 mm |
auf Bestellung 645 Stücke: Lieferzeit 10-14 Tag (e) |
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| HSB26-343408 |
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Hersteller: Same Sky
Heat Sinks heat sink, BGA, 33.5 x 33.5 x 8 mm
Heat Sinks heat sink, BGA, 33.5 x 33.5 x 8 mm
auf Bestellung 645 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.51 EUR |
| 10+ | 2.24 EUR |
| 25+ | 2.09 EUR |
| 50+ | 2 EUR |
| 100+ | 1.93 EUR |
| 250+ | 1.83 EUR |
| 500+ | 1.77 EUR |