HSB27-434316 CUI Devices
Hersteller: CUI Devices
Description: HEAT SINK, BGA, 43.1 X 43.1 X 16
Material: Aluminum Alloy
Packaging: Box
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.650" (16.51mm)
Thermal Resistance @ Natural: 8.35°C/W
Thermal Resistance @ Forced Air Flow: 2.80°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 8.98W @ 75°C
Attachment Method: Adhesive (Not Included)
Package Cooled: BGA
Width: 1.697" (43.10mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 1.697" (43.10mm)
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Technische Details HSB27-434316 CUI Devices
Description: HEAT SINK, BGA, 43.1 X 43.1 X 16, Material: Aluminum Alloy, Packaging: Box, Part Status: Active, Material Finish: Black Anodized, Fin Height: 0.650" (16.51mm), Thermal Resistance @ Natural: 8.35°C/W, Thermal Resistance @ Forced Air Flow: 2.80°C/W @ 200 LFM, Power Dissipation @ Temperature Rise: 8.98W @ 75°C, Attachment Method: Adhesive (Not Included), Package Cooled: BGA, Width: 1.697" (43.10mm), Type: Top Mount, Shape: Square, Pin Fins, Length: 1.697" (43.10mm).
Weitere Produktangebote HSB27-434316 nach Preis ab 3.12 EUR bis 4.26 EUR
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HSB27-434316 | CUI Devices |
Heat Sinks heat sink, BGA, 43.1 x 43.1 x 16.51mm |
auf Bestellung 510 Stücke: Lieferzeit 10-14 Tag (e) |
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| HSB27-434316 |
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Hersteller: CUI Devices
Heat Sinks heat sink, BGA, 43.1 x 43.1 x 16.51mm
Heat Sinks heat sink, BGA, 43.1 x 43.1 x 16.51mm
auf Bestellung 510 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 4.26 EUR |
| 10+ | 4.1 EUR |
| 25+ | 4 EUR |
| 50+ | 3.75 EUR |
| 100+ | 3.38 EUR |
| 250+ | 3.33 EUR |
| 500+ | 3.12 EUR |