HSB27-434316 CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, BGA, 43.1 X 43.1 X 16
Packaging: Box
Material: Aluminum Alloy
Length: 1.697" (43.10mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.697" (43.10mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 8.98W @ 75°C
Thermal Resistance @ Forced Air Flow: 2.80°C/W @ 200 LFM
Thermal Resistance @ Natural: 8.35°C/W
Fin Height: 0.650" (16.51mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 934 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 6+ | 3.01 EUR |
| 10+ | 2.96 EUR |
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Technische Details HSB27-434316 CUI Devices
Description: HEAT SINK, BGA, 43.1 X 43.1 X 16, Packaging: Box, Material: Aluminum Alloy, Length: 1.697" (43.10mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.697" (43.10mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 8.98W @ 75°C, Thermal Resistance @ Forced Air Flow: 2.80°C/W @ 200 LFM, Thermal Resistance @ Natural: 8.35°C/W, Fin Height: 0.650" (16.51mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB27-434316 nach Preis ab 3.12 EUR bis 4.26 EUR
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HSB27-434316 | Hersteller : CUI Devices |
Heat Sinks heat sink, BGA, 43.1 x 43.1 x 16.51mm |
auf Bestellung 510 Stücke: Lieferzeit 10-14 Tag (e) |
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