auf Bestellung 246 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 10.65 EUR |
| 10+ | 10.3 EUR |
| 25+ | 9.01 EUR |
| 50+ | 8.92 EUR |
| 120+ | 8.36 EUR |
| 240+ | 7.97 EUR |
| 600+ | 7.23 EUR |
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Technische Details HSB28-606022 Same Sky
Description: HEAT SINK, BGA, 60 X 60 X 22 MM,, Packaging: Box, Material: Aluminum Alloy, Length: 2.362" (60.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 2.362" (60.00mm), Package Cooled: BGA, Attachment Method: Push Pin, Power Dissipation @ Temperature Rise: 15.83W @ 75°C, Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM, Thermal Resistance @ Natural: 4.74°C/W, Fin Height: 0.866" (22.00mm), Material Finish: Black Anodized.
Weitere Produktangebote HSB28-606022 nach Preis ab 10.68 EUR bis 10.68 EUR
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HSB28-606022 | Hersteller : Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 60 X 60 X 22 MM,Packaging: Box Material: Aluminum Alloy Length: 2.362" (60.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 2.362" (60.00mm) Package Cooled: BGA Attachment Method: Push Pin Power Dissipation @ Temperature Rise: 15.83W @ 75°C Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM Thermal Resistance @ Natural: 4.74°C/W Fin Height: 0.866" (22.00mm) Material Finish: Black Anodized |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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