HSB28-606022 Same Sky (Formerly CUI Devices)
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 60 X 60 X 22 MM,
Packaging: Box
Material: Aluminum Alloy
Length: 2.362" (60.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 2.362" (60.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Power Dissipation @ Temperature Rise: 15.83W @ 75°C
Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 4.74°C/W
Fin Height: 0.866" (22.00mm)
Material Finish: Black Anodized
Produktrezensionen
Produktbewertung abgeben
Technische Details HSB28-606022 Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 60 X 60 X 22 MM,, Packaging: Box, Material: Aluminum Alloy, Length: 2.362" (60.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 2.362" (60.00mm), Package Cooled: BGA, Attachment Method: Push Pin, Power Dissipation @ Temperature Rise: 15.83W @ 75°C, Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM, Thermal Resistance @ Natural: 4.74°C/W, Fin Height: 0.866" (22.00mm), Material Finish: Black Anodized.
Weitere Produktangebote HSB28-606022 nach Preis ab 7.48 EUR bis 15.49 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
HSB28-606022 | Hersteller : Same Sky |
Heat Sinks heat sink, BGA, 60 x 60 x 22 mm, push pins |
auf Bestellung 119 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
| HSB28-606022 | Hersteller : Same Sky |
Category: Heatsinks Description: Heatsink: extruded; BGA; L: 60mm; W: 60mm; H: 22mm; anodized; 4.74°C/W Manufacturer series: HSB Type of heatsink: extruded Mounting: self-adhesive Height: 22mm Length: 60mm Width: 60mm Thermal resistance @200 LFM: 4.74°C/W Material finishing: anodized Application: BGA |
auf Bestellung 80 Stücke: Lieferzeit 14-21 Tag (e) |
|