HSB28-606022 CUI Devices
auf Bestellung 339 Stücke:
Lieferzeit 14-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 16.38 EUR |
| 10+ | 15.83 EUR |
| 25+ | 15.37 EUR |
| 50+ | 14.46 EUR |
| 100+ | 14.14 EUR |
| 500+ | 11.73 EUR |
| 1000+ | 11.57 EUR |
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Technische Details HSB28-606022 CUI Devices
Description: HEAT SINK, BGA, 60 X 60 X 22 MM,, Packaging: Box, Material: Aluminum Alloy, Length: 2.362" (60.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 2.362" (60.00mm), Package Cooled: BGA, Attachment Method: Push Pin, Power Dissipation @ Temperature Rise: 15.83W @ 75°C, Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM, Thermal Resistance @ Natural: 4.74°C/W, Fin Height: 0.866" (22.00mm), Material Finish: Black Anodized.
Weitere Produktangebote HSB28-606022
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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HSB28-606022 | Hersteller : CUI Devices |
 Description: HEAT SINK, BGA, 60 X 60 X 22 MM,Packaging: Box Material: Aluminum Alloy Length: 2.362" (60.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 2.362" (60.00mm) Package Cooled: BGA Attachment Method: Push Pin Power Dissipation @ Temperature Rise: 15.83W @ 75°C Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM Thermal Resistance @ Natural: 4.74°C/W Fin Height: 0.866" (22.00mm) Material Finish: Black Anodized |
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