
HSB28-606022 Same Sky (Formerly CUI Devices)

Description: HEAT SINK, BGA, 60 X 60 X 22 MM,
Packaging: Box
Material: Aluminum Alloy
Length: 2.362" (60.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 2.362" (60.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Power Dissipation @ Temperature Rise: 15.83W @ 75°C
Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 4.74°C/W
Fin Height: 0.866" (22.00mm)
Material Finish: Black Anodized
auf Bestellung 47 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
2+ | 10.63 EUR |
10+ | 8.81 EUR |
25+ | 8.1 EUR |
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Technische Details HSB28-606022 Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 60 X 60 X 22 MM,, Packaging: Box, Material: Aluminum Alloy, Length: 2.362" (60.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 2.362" (60.00mm), Package Cooled: BGA, Attachment Method: Push Pin, Power Dissipation @ Temperature Rise: 15.83W @ 75°C, Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM, Thermal Resistance @ Natural: 4.74°C/W, Fin Height: 0.866" (22.00mm), Material Finish: Black Anodized.
Weitere Produktangebote HSB28-606022 nach Preis ab 7.55 EUR bis 11.11 EUR
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HSB28-606022 | Hersteller : Same Sky |
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auf Bestellung 417 Stücke: Lieferzeit 10-14 Tag (e) |
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