HSE-B18254-035H-00 CUI Devices
auf Bestellung 375 Stücke:
Lieferzeit 14-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 13+ | 4.06 EUR |
| 14+ | 3.82 EUR |
| 25+ | 3.48 EUR |
| 50+ | 3.46 EUR |
| 100+ | 3.28 EUR |
| 250+ | 3.15 EUR |
| 500+ | 2.99 EUR |
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Technische Details HSE-B18254-035H-00 CUI Devices
Description: HEAT SINK, EXTRUSION, TO-218, 25, Packaging: Box, Material: Aluminum Alloy, Length: 1.000" (25.40mm), Shape: Rectangular, Angled Fins, Type: Board Level, Vertical, Width: 1.638" (41.60mm), Package Cooled: TO-218, Attachment Method: Clip and PC Pin, Power Dissipation @ Temperature Rise: 10.0W @ 75°C, Thermal Resistance @ Forced Air Flow: 4.03°C/W @ 200 LFM, Thermal Resistance @ Natural: 7.50°C/W, Fin Height: 0.984" (25.00mm), Material Finish: Black Anodized.
Weitere Produktangebote HSE-B18254-035H-00
| Foto | Bezeichnung | Hersteller | Beschreibung |
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Preis ohne MwSt |
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HSE-B18254-035H-00 | Hersteller : CUI Devices |
 Description: HEAT SINK, EXTRUSION, TO-218, 25Packaging: Box Material: Aluminum Alloy Length: 1.000" (25.40mm) Shape: Rectangular, Angled Fins Type: Board Level, Vertical Width: 1.638" (41.60mm) Package Cooled: TO-218 Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 10.0W @ 75°C Thermal Resistance @ Forced Air Flow: 4.03°C/W @ 200 LFM Thermal Resistance @ Natural: 7.50°C/W Fin Height: 0.984" (25.00mm) Material Finish: Black Anodized |
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