HSE-B18635-035H CUI DEVICES
Hersteller: CUI DEVICES
Heat Sink Passive TO-218 Vertical Thru-Hole Aluminum 6063-T5 4.49C/W Black Anodized
Heat Sink Passive TO-218 Vertical Thru-Hole Aluminum 6063-T5 4.49C/W Black Anodized
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Technische Details HSE-B18635-035H CUI DEVICES
Description: HEAT SINK, EXTRUSION,TO-218, 63., Packaging: Box, Material: Aluminum Alloy, Length: 2.500" (63.50mm), Shape: Rectangular, Angled Fins, Type: Board Level, Vertical, Width: 1.638" (41.60mm), Package Cooled: TO-218, Attachment Method: Bolt On and PC Pin, Power Dissipation @ Temperature Rise: 16.7W @ 75°C, Thermal Resistance @ Forced Air Flow: 2.24°C/W @ 200 LFM, Thermal Resistance @ Natural: 4.49°C/W, Fin Height: 0.984" (25.00mm), Material Finish: Black Anodized.
Weitere Produktangebote HSE-B18635-035H
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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HSE-B18635-035H | Hersteller : CUI DEVICES | Extruded Heat Sink, TO-218 |
Produkt ist nicht verfügbar |
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HSE-B18635-035H | Hersteller : CUI DEVICES | Extruded Heat Sink, TO-218 |
Produkt ist nicht verfügbar |
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HSE-B18635-035H | Hersteller : CUI Devices |
Description: HEAT SINK, EXTRUSION,TO-218, 63. Packaging: Box Material: Aluminum Alloy Length: 2.500" (63.50mm) Shape: Rectangular, Angled Fins Type: Board Level, Vertical Width: 1.638" (41.60mm) Package Cooled: TO-218 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 16.7W @ 75°C Thermal Resistance @ Forced Air Flow: 2.24°C/W @ 200 LFM Thermal Resistance @ Natural: 4.49°C/W Fin Height: 0.984" (25.00mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
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HSE-B18635-035H | Hersteller : CUI Devices | Heat Sinks 63.5x41.6x25mm w/pin extrusion TO-218 |
Produkt ist nicht verfügbar |