HSE-B20254-035H-02 CUI Devices
auf Bestellung 726 Stücke:
Lieferzeit 14-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 25+ | 2.15 EUR |
| 26+ | 2.06 EUR |
| 27+ | 1.94 EUR |
| 50+ | 1.91 EUR |
| 100+ | 1.7 EUR |
| 250+ | 1.63 EUR |
| 500+ | 1.56 EUR |
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Technische Details HSE-B20254-035H-02 CUI Devices
Description: HEAT SINK, EXTRUSION, TO-220, 25, Packaging: Box, Material: Aluminum Alloy, Length: 1.000" (25.40mm), Shape: Rectangular, Angled Fins, Type: Board Level, Vertical, Width: 1.378" (35.00mm), Package Cooled: TO-220, Attachment Method: Bolt On and PC Pin, Power Dissipation @ Temperature Rise: 5.5W @ 75°C, Thermal Resistance @ Forced Air Flow: 4.39°C/W @ 200 LFM, Thermal Resistance @ Natural: 13.64°C/W, Fin Height: 0.500" (12.70mm), Material Finish: Black Anodized.
Weitere Produktangebote HSE-B20254-035H-02
| Foto | Bezeichnung | Hersteller | Beschreibung |
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HSE-B20254-035H-02 | Hersteller : CUI Devices |
 Description: HEAT SINK, EXTRUSION, TO-220, 25Packaging: Box Material: Aluminum Alloy Length: 1.000" (25.40mm) Shape: Rectangular, Angled Fins Type: Board Level, Vertical Width: 1.378" (35.00mm) Package Cooled: TO-220 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 5.5W @ 75°C Thermal Resistance @ Forced Air Flow: 4.39°C/W @ 200 LFM Thermal Resistance @ Natural: 13.64°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized |
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