HSE-B250-04H CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, EXTRUSION, TO-220, 25
Packaging: Box
Material: Aluminum Alloy
Length: 0.984" (25.00mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.378" (35.00mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 8.0W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.26°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.60°C/W
Fin Height: 1.000" (25.40mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2221 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 10+ | 1.83 EUR |
| 25+ | 1.79 EUR |
| 50+ | 1.74 EUR |
| 100+ | 1.64 EUR |
| 250+ | 1.54 EUR |
| 750+ | 1.45 EUR |
| 1500+ | 1.35 EUR |
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Technische Details HSE-B250-04H CUI Devices
Description: HEAT SINK, EXTRUSION, TO-220, 25, Packaging: Box, Material: Aluminum Alloy, Length: 0.984" (25.00mm), Shape: Rectangular, Fins, Type: Board Level, Vertical, Width: 1.378" (35.00mm), Package Cooled: TO-220, Attachment Method: Bolt On and PC Pin, Power Dissipation @ Temperature Rise: 8.0W @ 75°C, Thermal Resistance @ Forced Air Flow: 3.26°C/W @ 200 LFM, Thermal Resistance @ Natural: 13.60°C/W, Fin Height: 1.000" (25.40mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSE-B250-04H nach Preis ab 2.08 EUR bis 2.49 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||||||
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HSE-B250-04H | Hersteller : CUI Devices |
Heat Sinks 25x35x25.4mm w/pin extrusion TO-220 |
auf Bestellung 489 Stücke: Lieferzeit 14-28 Tag (e) |
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HSE-B250-04H | Hersteller : CUI DEVICES |
Heat Sink Passive TO-220 Vertical Thru-Hole Aluminum 6063-T5 Black Anodized |
Produkt ist nicht verfügbar |