HSE-B381-04H CUI Devices
auf Bestellung 787 Stücke:
Lieferzeit 14-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 26+ | 2 EUR |
| 27+ | 1.98 EUR |
| 100+ | 1.95 EUR |
| 250+ | 1.94 EUR |
| 500+ | 1.93 EUR |
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Technische Details HSE-B381-04H CUI Devices
Description: HEAT SINK, EXTRUSION, TO-220/TO-, Packaging: Box, Material: Aluminum Alloy, Length: 1.500" (38.10mm), Shape: Rectangular, Fins, Type: Board Level, Vertical, Width: 0.650" (16.50mm), Package Cooled: TO-218, TO-220, Attachment Method: Bolt On and PC Pin, Power Dissipation @ Temperature Rise: 5.9W @ 75°C, Thermal Resistance @ Forced Air Flow: 4.44°C/W @ 200 LFM, Thermal Resistance @ Natural: 12.71°C/W, Fin Height: 0.630" (16.00mm), Material Finish: Black Anodized.
Weitere Produktangebote HSE-B381-04H
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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HSE-B381-04H | Hersteller : CUI Devices |
 Description: HEAT SINK, EXTRUSION, TO-220/TO-Packaging: Box Material: Aluminum Alloy Length: 1.500" (38.10mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 0.650" (16.50mm) Package Cooled: TO-218, TO-220 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 5.9W @ 75°C Thermal Resistance @ Forced Air Flow: 4.44°C/W @ 200 LFM Thermal Resistance @ Natural: 12.71°C/W Fin Height: 0.630" (16.00mm) Material Finish: Black Anodized |
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