HSE01-193175P CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, EXTRUSION, 19 X 31.5
Packaging: Box
Material: Aluminum Alloy
Length: 0.748" (19.00mm)
Shape: Square, Angled Fins
Type: Top Mount
Width: 0.748" (19.00mm)
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.95W @ 75°C
Thermal Resistance @ Forced Air Flow: 9.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 25.44°C/W
Fin Height: 0.295" (7.50mm)
Material Finish: Blue Anodized
Part Status: Active
auf Bestellung 2108 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 6+ | 3.08 EUR |
| 10+ | 2.98 EUR |
| 25+ | 2.89 EUR |
| 50+ | 2.72 EUR |
| 100+ | 2.45 EUR |
| 250+ | 2.41 EUR |
| 500+ | 2.26 EUR |
| 1000+ | 2.22 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details HSE01-193175P CUI Devices
Description: HEAT SINK, EXTRUSION, 19 X 31.5, Packaging: Box, Material: Aluminum Alloy, Length: 0.748" (19.00mm), Shape: Square, Angled Fins, Type: Top Mount, Width: 0.748" (19.00mm), Attachment Method: Thermal Tape, Adhesive (Included), Power Dissipation @ Temperature Rise: 2.95W @ 75°C, Thermal Resistance @ Forced Air Flow: 9.20°C/W @ 200 LFM, Thermal Resistance @ Natural: 25.44°C/W, Fin Height: 0.295" (7.50mm), Material Finish: Blue Anodized, Part Status: Active.
Weitere Produktangebote HSE01-193175P nach Preis ab 2.06 EUR bis 3.12 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
HSE01-193175P | Hersteller : CUI Devices |
Heat Sinks heat sink, extrusion, 19 x 31.5 x 7.5 mm, T411 pad |
auf Bestellung 1446 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
|
HSE01-193175P | Hersteller : Same Sky |
Heat Sinks heat sink, extrusion, 19 x 31.5 x 7.5 mm, T411 pad |
auf Bestellung 1400 Stücke: Lieferzeit 10-14 Tag (e) |
|