HSE02-173213P CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, EXTRUSION, 17 X 31.9
Packaging: Box
Material: Aluminum Alloy
Length: 0.669" (17.00mm)
Shape: Square, Angled Fins
Type: Top Mount
Width: 0.669" (17.00mm)
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.5W @ 75°C
Thermal Resistance @ Forced Air Flow: 6.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 21.44°C/W
Fin Height: 0.492" (12.50mm)
Material Finish: Blue Anodized
Part Status: Active
auf Bestellung 2262 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 4.65 EUR |
| 10+ | 4.49 EUR |
| 25+ | 4.36 EUR |
| 50+ | 4.1 EUR |
| 100+ | 3.68 EUR |
| 250+ | 3.63 EUR |
| 500+ | 3.4 EUR |
| 1000+ | 3.35 EUR |
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Technische Details HSE02-173213P CUI Devices
Description: HEAT SINK, EXTRUSION, 17 X 31.9, Packaging: Box, Material: Aluminum Alloy, Length: 0.669" (17.00mm), Shape: Square, Angled Fins, Type: Top Mount, Width: 0.669" (17.00mm), Attachment Method: Thermal Tape, Adhesive (Included), Power Dissipation @ Temperature Rise: 3.5W @ 75°C, Thermal Resistance @ Forced Air Flow: 6.70°C/W @ 200 LFM, Thermal Resistance @ Natural: 21.44°C/W, Fin Height: 0.492" (12.50mm), Material Finish: Blue Anodized, Part Status: Active.
Weitere Produktangebote HSE02-173213P nach Preis ab 5.04 EUR bis 6.92 EUR
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HSE02-173213P | Hersteller : CUI Devices |
Heat Sinks heat sink, extrusion, 17 x 31.9 x 12.5 mm, T411 pad |
auf Bestellung 857 Stücke: Lieferzeit 14-28 Tag (e) |
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